Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing

IMECH-IR > 力学所知识产出(1956-2008)

	Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing
	ZHOU Zhimin; Yong ZHOU; Zhang TH(张泰华); Zhou, Y (reprint author), Shanghai Jiao Tong Univ, Key Lab Thin Film & Microfabricat Technol, Minist Educ, Res Inst Micro Nanometer Sci & Technol, Shanghai 200030, Peoples R China.
发表期刊	Journal of Materials Science & Technology
	2006
卷号	22 期号:3 页码:345-348
ISSN	1005-0302
摘要	Microbridge testing was used to measure the Young's modulus and residual stress of metallic films. Samples of freestanding NiFe film microbridge were fabricated by microelectromechanical systems. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curve of NiFe film microbridge by the Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of load-deflection curves of the microbridges was proposed to evaluate the Young's modulus and residual stress of the films simultaneously. The calculated results based on experimental measurements show that the average Young's modulus and residual stress for the electroplated NiFe films are 203.2 GPa and 333.0 MlPa, respectively, while the Young's modulus measured by the Nano-hardness method is 209.6 +/- 11.8 GPa for the thick NiFe film with silicon substrate.
学科领域	力学
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000238133800015
关键词[WOS]	THIN-FILMS ; MECHANICAL-PROPERTIES ; PLATED PERMALLOY ; MEMS MATERIALS ; STRENGTH ; SILICON
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
引用统计	被引频次：6[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/15329
专题	力学所知识产出(1956-2008)
通讯作者	Zhou, Y (reprint author), Shanghai Jiao Tong Univ, Key Lab Thin Film & Microfabricat Technol, Minist Educ, Res Inst Micro Nanometer Sci & Technol, Shanghai 200030, Peoples R China.
推荐引用方式 GB/T 7714	ZHOU Zhimin,Yong ZHOU,Zhang TH,et al. Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing[J]. Journal of Materials Science & Technology,2006,22,3,:345-348.
APA	ZHOU Zhimin,Yong ZHOU,张泰华,&Zhou, Y .(2006).Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing.Journal of Materials Science & Technology,22(3),345-348.
MLA	ZHOU Zhimin,et al."Evaluation of Young's Modulus and Residual Stress of NiFe Film by Microbridge Testing".Journal of Materials Science & Technology 22.3(2006):345-348.

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