Flip Chip Technologies and Their Applications in MEMS Packaging

IMECH-IR > 力学所知识产出(1956-2008)

	Flip Chip Technologies and Their Applications in MEMS Packaging
	Wang HY(汪海英); Bai YL(白以龙); Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
发表期刊	International Journal of Nonlinear Sciences and Numerical Simulation
	2002
卷号	3 期号:3-4 页码:433-436
ISSN	1565-1339
摘要	The high cost and undesirable bulky packages have been and continues to be major stumbling blocks in commercializing MEMS products. Flip chip technologies are very promising techniques for MEMS packaging. This paper presents a brief introduction of flip chip technologies as well as examples of successful applications of flip chip technologies in MEMS (e.g. RF and optical MEMS, micro sensors) packaging. The result shows that, although MEMS packaging is much more complicated than that for microelectronics, flip chip technologies can be applicable means of integrating MEMS devices. It is also shown that to meet different packaging requirements of various MEMS devices, bumping materials, bumping process and joining methods must be chosen carefully. Issues, such as package deformation, temperature distributions, heat sink placement, are all very crucial for the performance of MEMS devices and should be considered in MEMS packaging design.
学科领域	力学
收录类别	SCI
语种	英语
WOS记录号	WOS:000176903800061
WOS研究方向	Engineering ; Mathematics ; Mechanics ; Physics
WOS类目	Engineering, Multidisciplinary ; Mathematics, Applied ; Mechanics ; Physics, Mathematical
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/15468
专题	力学所知识产出(1956-2008)
通讯作者	Wang, HY (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
推荐引用方式 GB/T 7714	Wang HY,Bai YL,Wang, HY . Flip Chip Technologies and Their Applications in MEMS Packaging[J]. International Journal of Nonlinear Sciences and Numerical Simulation,2002,3,3-4,:433-436.
APA	Wang HY,Bai YL,&Wang, HY .(2002).Flip Chip Technologies and Their Applications in MEMS Packaging.International Journal of Nonlinear Sciences and Numerical Simulation,3(3-4),433-436.
MLA	Wang HY,et al."Flip Chip Technologies and Their Applications in MEMS Packaging".International Journal of Nonlinear Sciences and Numerical Simulation 3.3-4(2002):433-436.

条目包含的文件		下载所有文件
文件名称/大小	文献类型	版本类型	开放类型	使用许可
ja347.pdf（752KB）			开放获取	--	浏览下载