IMECH-IR  > 力学所知识产出(1956-2008)
Mechanics of Adhesion in MEMS-a Review
Zhao YP(赵亚溥); Wang LS(王立森); Yu TX(余同希)
Source PublicationJournal of Adhesion Science and Technology
2003
Volume17Issue:4Pages:519-546
ISSN0169-4243
AbstractA review is presented of the mechanics of microscale adhesion in microelectromechanical systems (MEMS). Some governing dimensionless numbers such as Tabor number, adhesion parameter and peel number for microscale elastic adhesion contact are discussed in detail. The peel number is modified for the elastic contact between a rough surface in contact with a smooth plane. Roughness ratio is introduced to characterize the relative importance of surface roughness for microscale adhesion contact, and three kinds of asperity height distributions are discussed: Gaussian, fractal, and exponential distributions. Both Gaussian and exponential distributions are found to be special cases of fractal distribution. Casimir force induced adhesion in MEMS, and adhesion of carbon nanotubes to a substrate are also discussed. Finally, microscale plastic adhesion contact theory is briefly reviewed, and it is found that the dimensionless number, plasticity index of various forms, can be expressed by the roughness ratio.
Subject Area力学
DOI10.1163/15685610360554393
Indexed BySCI
Language英语
WOS IDWOS:000182207800003
WOS Research AreaEngineering ; Materials Science ; Mechanics
WOS SubjectEngineering, Chemical ; Materials Science, Multidisciplinary ; Mechanics
Citation statistics
Cited Times:287[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/16272
Collection力学所知识产出(1956-2008)
Recommended Citation
GB/T 7714
Zhao YP,Wang LS,Yu TX. Mechanics of Adhesion in MEMS-a Review[J]. Journal of Adhesion Science and Technology,2003,17(4):519-546.
APA 赵亚溥,王立森,&余同希.(2003).Mechanics of Adhesion in MEMS-a Review.Journal of Adhesion Science and Technology,17(4),519-546.
MLA 赵亚溥,et al."Mechanics of Adhesion in MEMS-a Review".Journal of Adhesion Science and Technology 17.4(2003):519-546.
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