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Title:
Laser drilling improving circuit board manufacturing
Alternative Title: 激光钻孔改善印刷线路板制造
Author: Yu G(虞钢); Zhang JC(张金城); Gao CL(高春林); Wang HC(王红才); Li P(李平); An YQ(安永强); Zhang GQ(张桂秋)
Issued Date: 1998
Conference Name: LASER PROCESSING OF MATERIALS AND INDUSTRIAL APPLICATIONS II
Conference Date: 1998
Abstract: We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd: YAG laser, a computer control system and an X-Y moving table which can handle up to 400 x 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 mu s and maximum peak power over 10kW at 10k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill hobs including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.
Indexed Type: CPCI-S
Subject: 力学
Corresponding Author: 虞钢
Source: Laser Processing of Materials and Industrial Applications II,1998,3550:1-6
Language: 英语
WOS ID: WOS:000076895500001
Citation statistics:
Content Type: 会议论文
URI: http://dspace.imech.ac.cn/handle/311007/16602
Appears in Collections:力学所知识产出(1956-2008)_会议论文

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Recommended Citation:
Yu G,Zhang JC,Gao CL,et al. Laser drilling improving circuit board manufacturing[C]. 见:LASER PROCESSING OF MATERIALS AND INDUSTRIAL APPLICATIONS II. 1998
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