Effects of Nanostructures on the Fracture Strength of the Interfaces in Nacre

doi:10.1557/JMR.2003.0239

IMECH-IR > 力学所知识产出(1956-2008)

	Effects of Nanostructures on the Fracture Strength of the Interfaces in Nacre
	Song F(宋凡); Bai YL(白以龙); Song, F (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
发表期刊	Journal of Materials Research
	2003
卷号	18 期号:8 页码:1741-1744
ISSN	0884-2914
摘要	A strengthening mechanism arising from a type of inorganic nanostructure in the organic matrix layers is presented by studying the structural and mechanical properties of the interfaces in nacre. This nanostructural mechanism not only averagely increases the fracture strength of the organic matrix interfaces by about 5 times, but also effectively arrests the cracks in the organic matrix layers and causes the crack deflection in this biomaterial. The present investigation shows that the main mechanism governing the strength of the organic matrix interfaces relies on the inorganic nanostructures rather than the organic matrix. This study provides a guide to the interfacial design of synthetic materials.
学科领域	力学
DOI	10.1557/JMR.2003.0239
收录类别	SCI
语种	英语
WOS记录号	WOS:000184611200001
关键词[WOS]	DEFORMATION ; COMPOSITES ; STRATEGIES ; DESIGN
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
引用统计	被引频次：94[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/16609
专题	力学所知识产出(1956-2008)
通讯作者	Song, F (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China.
推荐引用方式 GB/T 7714	Song F,Bai YL,Song, F . Effects of Nanostructures on the Fracture Strength of the Interfaces in Nacre[J]. Journal of Materials Research,2003,18,8,:1741-1744.
APA	宋凡,白以龙,&Song, F .(2003).Effects of Nanostructures on the Fracture Strength of the Interfaces in Nacre.Journal of Materials Research,18(8),1741-1744.
MLA	宋凡,et al."Effects of Nanostructures on the Fracture Strength of the Interfaces in Nacre".Journal of Materials Research 18.8(2003):1741-1744.

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