Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates

IMECH-IR > 力学所知识产出(1956-2008)

	Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates
	Wei YG(魏悦广)
会议录名称	Materials Research Society Symposium Proceedings
	2002
页码	305-310
会议名称	SURFACE ENGINEERING 2001 - FUNDAMENTALS AND APPLICATIONS
会议日期	2001
摘要	Peel test methods are assessed through being applied to a peeling analysis of the ductile film/ceramic substrate system. Through computing the fracture work of the system using the either beam bend model (BB model) or the general plane analysis model (GPA model), surprisingly, a big difference between both model results is found. Although the BB model can capture the plastic dissipation phenomenon for the ductile film case as the GPA model can, it is much sensitive to the choice of the peeling criterion parameters, and it overestimates the plastic bending effect unable to capture crack tip constraint plasticity. In view of the difficulty of measuring interfacial toughness using peel test method when film is the ductile material, a new test method, split test, is recommended and analyzed using the GPA model. The prediction is applied to a wedge-loaded experiment for Al-alloy double-cantilever beam in literature.
WOS记录号	WOS:000178303600045
ISBN号	1-55899-633-8
URL	查看原文
收录类别	CPCI-S ; EI
语种	英语
引用统计
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/17176
专题	力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Wei YG. Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates[C]Materials Research Society Symposium Proceedings,2002:305-310.

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