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Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum | |
Liu CR; Lu XY; Yang ZY(杨振宇); Meng QS; Meng, QS (reprint author), Taiyuan Univ Technol, China Educ Minist & Shanxi Provence, Key Lab Adv Mat & Interface Sci, Taiyuan 030024, Peoples R China. | |
发表期刊 | International Journal of Nonlinear Sciences and Numerical Simulation |
2008 | |
页码 | 347-353 |
ISSN | 1565-1339 |
摘要 | The bonding of glass wafer to aluminum foils in multi-layer assemblies was made by the common anodic bonding process. The bonding was performed at temperatures in the range 350-450 degrees C and with an applied voltage in the range 400-700 V under a pressure of 0.05 MPa. Residual stress and deformation in samples of two-layer (aluminum/glass) and three-layer (glass/aluminum/glass) were analyzed by nonlinear finite element simulation software MARC. The stress and strain varying with cooling time were obtained. The analyzed results show that deformation of the three-layer sample is significantly smaller than that of the two-layer sample, because of the symmetric structure of the three-layer sample. This has an important advantage in MEMS fabrication. The maximum equivalent stresses locate in the transition layer in both samples, which will become weakness in bonded sample. |
关键词 | Anodic Bonding Mems Aluminum Glass Residual Stress Finite Element |
收录类别 | SCI |
语种 | 英语 |
WOS记录号 | WOS:000260106100006 |
WOS研究方向 | Engineering ; Mathematics ; Mechanics ; Physics |
WOS类目 | Engineering, Multidisciplinary ; Mathematics, Applied ; Mechanics ; Physics, Mathematical |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://dspace.imech.ac.cn/handle/311007/25878 |
专题 | 力学所知识产出(1956-2008) |
通讯作者 | Meng, QS (reprint author), Taiyuan Univ Technol, China Educ Minist & Shanxi Provence, Key Lab Adv Mat & Interface Sci, Taiyuan 030024, Peoples R China. |
推荐引用方式 GB/T 7714 | Liu CR,Lu XY,Yang ZY,et al. Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum[J]. International Journal of Nonlinear Sciences and Numerical Simulation,2008:347-353. |
APA | Liu CR,Lu XY,杨振宇,Meng QS,&Meng, QS .(2008).Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum.International Journal of Nonlinear Sciences and Numerical Simulation,347-353. |
MLA | Liu CR,et al."Residual Stress And Deformation Analysis Of Anodic Bonded Multi-Layer Of Glass And Aluminum".International Journal of Nonlinear Sciences and Numerical Simulation (2008):347-353. |
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