IMECH-IR  > 微重力重点实验室
Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling
Wei JJ(魏进家); Zhao JF(赵建福); Yuan M; Xue YF(薛艳芳); Wei JJ(魏进家)
Source PublicationMicrogravity Science and Technology
2009
Volume21Issue:S1Pages:S159-S173
ISSN0938-0108
AbstractFor efficiently cooling electronic components with high heat flux, experiments were conducted to study the flow boiling heat transfer performance of FC-72 over square silicon chips with the dimensions of 10 × 10 × 0.5 mm3. Four kinds of micro-pin-fins with the dimensions of 30 × 60, 30 × 120, 50 × 60, 50 × 120 μm2 (thickness, t × height, h) were fabricated on the chip surfaces by the dry etching technique for enhancing boiling heat transfer. A smooth surface was also tested for comparison. The experiments were made at three different fluid velocities (0.5, 1 and 2 m/s) and three different liquid subcoolings (15, 25 and 35 K). The results were compared with the previous published data of pool boiling. All micro-pin-fined surfaces show a considerable heat transfer enhancement compared with a smooth surface. Flow boiling can remarkably decrease wall superheat compared with pool boiling. At the velocities lower than 1 m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat. For all surfaces, the maximum allowable heat flux, qmax, for the normal operation of LSI chips increases with fluid velocity and subcooling. For all micro-pin-finned surfaces, the wall temperature at the critical heat flux (CHF) is less than the upper limit for the reliable operation of LSI chips, 85◦C. The largest value of qmax can reach nearly 148 W/cm2 for micro-pin-finned chips with the fin height of 120 μm at the fluid velocity of 2 m/s and the liquid subcooling of 35 K. The perspectives for the boiling heat transfer experiment of the prospective micro-pin-finned sur- faces, which has been planned to be made in the Drop Tower Beijing/NMLC in the future, are also presented.
Subject Area微重力流体力学
DOI10.1007/s12217-009-9137-5
Indexed BySCI
Language英语
WOS IDWOS:000268745900022
WOS KeywordSILICON CHIPS ; FC-72 ; ARRAYS
WOS Research AreaEngineering ; Thermodynamics ; Mechanics
WOS SubjectEngineering, Aerospace ; Thermodynamics ; Mechanics
Citation statistics
Cited Times:32[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/28765
Collection微重力重点实验室
Corresponding AuthorWei JJ(魏进家)
Recommended Citation
GB/T 7714
Wei JJ,Zhao JF,Yuan M,et al. Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling[J]. Microgravity Science and Technology,2009,21,S1,:S159-S173.
APA Wei JJ,赵建福,Yuan M,Xue YF,&魏进家.(2009).Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling.Microgravity Science and Technology,21(S1),S159-S173.
MLA Wei JJ,et al."Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling".Microgravity Science and Technology 21.S1(2009):S159-S173.
Files in This Item: Download All
File Name/Size DocType Version Access License
MGST-JJWEI.pdf(691KB) 开放获取LicenseView Download
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Lanfanshu
Similar articles in Lanfanshu
[Wei JJ(魏进家)]'s Articles
[赵建福]'s Articles
[Yuan M]'s Articles
Baidu academic
Similar articles in Baidu academic
[Wei JJ(魏进家)]'s Articles
[赵建福]'s Articles
[Yuan M]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Wei JJ(魏进家)]'s Articles
[赵建福]'s Articles
[Yuan M]'s Articles
Terms of Use
No data!
Social Bookmark/Share
File name: MGST-JJWEI.pdf
Format: Adobe PDF
This file does not support browsing at this time
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.