Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

doi:10.1016/j.actamat.2006.12.040

IMECH-IR > 力学所知识产出(1956-2008)

	Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al
	Chen SD; Ke FJ(柯孚久); Zhou M; Bai YL(白以龙); Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
发表期刊	Acta Materialia
	2007
卷号	55 期号:9 页码:3169-3175
ISSN	1359-6454
摘要	Molecular dynamics (MD) simulations are carried out to analyze the diffusion bonding at Cu/Al interfaces. The results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses. At temperatures below 750 K, the interface thickness is found to increase in a stepwise manner as a function of time. At temperatures above 750 K, the thickness increases rapidly and smoothly. When surface roughness is present, the bonding process consists of three stages. In the first stage, surfaces deform under stress, resulting in increased contact areas. The second stage involves significant plastic deformation at the interface as temperature increases, resulting in the disappearance of interstices and full contact of the surface pair. The last stage entails the diffusion of atoms under constant temperature. The bonded specimens show tensile strengths reaching 88% of the ideal Cu/Al contact strength. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
关键词	Diffusion Bonding Molecular Dynamics Temperature Effect Tensile Strength Molecular-dynamics Simulation Embedded-atom-method Theoretical-model Interface Alloys Copper Metals Ni
DOI	10.1016/j.actamat.2006.12.040
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000246653000025
关键词[WOS]	MOLECULAR-DYNAMICS SIMULATION ; EMBEDDED-ATOM-METHOD ; THEORETICAL-MODEL ; INTERFACE ; ALLOYS ; COPPER ; METALS ; NI
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
引用统计	被引频次：146[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/33987
专题	力学所知识产出(1956-2008)
通讯作者	Chen, SD (reprint author), Chinese Acad Sci, State Key Lab Non Linear Mech, Inst Mech, Beijing 100080, Peoples R China.
推荐引用方式 GB/T 7714	Chen SD,Ke FJ,Zhou M,et al. Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al[J]. Acta Materialia,2007,55,9,:3169-3175.
APA	Chen SD,柯孚久,Zhou M,白以龙,&Chen, SD .(2007).Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al.Acta Materialia,55(9),3169-3175.
MLA	Chen SD,et al."Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al".Acta Materialia 55.9(2007):3169-3175.

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