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微桥法镍膜的弹性模量和残余应力测量
Alternative TitleMeasurements of Elastic Modulus and Residual Stress of Nickel Film by Microbridge Testing Methods
王明军; 周勇; 陈吉安; 杨春生; 张亚民; 高孝裕; 周志敏; 张泰华
Source Publication电子元件与材料
2004-12-30
Volume23Issue:12Pages:13-16
ISSN1001-2028
Abstract利用MEMS技术制作了不同尺寸的镍(Ni)膜微桥结构样品.采用纳米压痕仪XP系统测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了两种不同尺寸的Ni膜的弹性模量和残余应力.结果表明,两种不同尺寸的Ni膜的弹性模量结果一致,为190 GPa左右,但是残余应力变化较大.与采用纳米压痕仪直接测得的带有硅(Si)基底的Ni膜弹性模量186.8±7.5 GPa相比较,两者符合较好.
Keyword材料测量与分析技术 镍膜微桥 Mems技术 弹性模量 残余应力
Indexed ByCSCD
Language中文
Funding Organization国家重点基础研究发展规划(973)项目(G1999033103)
CSCD IDCSCD:1665502
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Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/41632
Collection力学所知识产出(1956-2008)
Corresponding Author王明军
Recommended Citation
GB/T 7714
王明军,周勇,陈吉安,等. 微桥法镍膜的弹性模量和残余应力测量[J]. 电子元件与材料,2004,23(12):13-16.
APA 王明军.,周勇.,陈吉安.,杨春生.,张亚民.,...&张泰华.(2004).微桥法镍膜的弹性模量和残余应力测量.电子元件与材料,23(12),13-16.
MLA 王明军,et al."微桥法镍膜的弹性模量和残余应力测量".电子元件与材料 23.12(2004):13-16.
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