IMECH-IR  > 力学所知识产出(1956-2008)
微桥结构铜膜杨氏模量和残余应力研究
周勇; 杨春生; 陈吉安; 丁桂甫; 王莉; 王明军; 张亚民; 张泰华
Source Publication现代科学仪器
2003-08-25
Issue4Pages:45-48
Abstract采用MEMS(MicroelectromechanicalSystems)技术研制了铜 (Cu)膜微桥结构试样 ,应用陶瓷压条为承力单元 ,并与纳米压痕仪XP系统的Berkovich三棱锥压头相结合 ,解决了较宽Cu膜微桥加载问题。测量了微桥载荷与位移的关系 ,并结合微桥力学理论模型得到了Cu膜微桥的杨氏模量及残余应力 ,其值分别为 115 .2GPa和 19.3MPa ,与应用纳米压痕仪直接测得的带有Si基底的Cu膜杨氏模量 110± 1.6 7GPa相吻合。
KeywordCu膜微桥 Mems技术 力学性能
Language中文
Funding Organization国家重点基础研究发展规划 (973)项目—“集成微光机电系统研究”子项目 (G1 9990 331 0 3)资助
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/42072
Collection力学所知识产出(1956-2008)
Corresponding Author周勇
Recommended Citation
GB/T 7714
周勇,杨春生,陈吉安,等. 微桥结构铜膜杨氏模量和残余应力研究[J]. 现代科学仪器,2003(4):45-48.
APA 周勇.,杨春生.,陈吉安.,丁桂甫.,王莉.,...&张泰华.(2003).微桥结构铜膜杨氏模量和残余应力研究.现代科学仪器(4),45-48.
MLA 周勇,et al."微桥结构铜膜杨氏模量和残余应力研究".现代科学仪器 .4(2003):45-48.
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