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多裂纹导电薄板电热温度场和应力场的计算
Alternative TitleCalculation of the electrothermal temperature and stress fields in a conductive thin plate with multiple cracks
田振国; 马世麟; 白象忠; 付宇明
Source Publication工程力学
2003-10-30
Volume20Issue:5Pages:70-75
ISSN1000-4750
Abstract讨论了对带有n个共线裂纹的薄板,在无穷远处加载电流实施止裂时板内的温度场和应力场。文中利用了复变函数的方法计算得到了电流场、温度场和应力场的分布状态。计算中考虑了材料热传导系数、线胀系数、弹性模量随温度的变化。作为算例,以带有两个共线裂纹、牌号为GH2132的高温合金制成的薄板进行了计算,给出了应力、温度与加载的电流密度及裂纹尺寸的关系;分析了导热系数随温度的变化对温度场数值的影响。
Keyword热-磁-弹性耦合 裂纹止裂 复变函数 应力场 导电薄板
Indexed ByCSCD
Language中文
Funding Organization国家自然科学基金资助项目(50275128)
CSCD IDCSCD:1164316
Citation statistics
Cited Times:1[CSCD]   [CSCD Record]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/42262
Collection力学所知识产出(1956-2008)
Corresponding Author田振国
Recommended Citation
GB/T 7714
田振国,马世麟,白象忠,等. 多裂纹导电薄板电热温度场和应力场的计算[J]. 工程力学,2003,20(5):70-75.
APA 田振国,马世麟,白象忠,&付宇明.(2003).多裂纹导电薄板电热温度场和应力场的计算.工程力学,20(5),70-75.
MLA 田振国,et al."多裂纹导电薄板电热温度场和应力场的计算".工程力学 20.5(2003):70-75.
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