IMECH-IR  > 力学所知识产出(1956-2008)
具有圆弧裂纹载流薄板的温度效应分析
Alternative TitleANALYSIS OF TEMPERATURE EFFECT IN CURRENT-CARRYING PLATE WITH AN ARC-CRACK
杨春燕; 白象忠; 田振国
Source Publication机械强度
2004-02-29
Volume26Issue:1Pages:87-91
ISSN1001-9669
Abstract给出含有圆弧裂纹的载流薄板在通入强大脉冲电流瞬间,裂纹尖端处温度场分布的复变函数解.该解是在首先求解通电瞬间,裂纹尖端处所形成的点热源功率的情况下得到的.它为进一步求解裂纹尖端处的应力场奠定了基础.文中给出的算例表明,适当控制通入的电流强度,可以达到有效控制裂尖熔化区尺寸以及形成焊口的目的.
Keyword圆弧裂纹 载流薄板 裂纹尖端 温度场 复变函数
Indexed ByCSCD
Language中文
Funding Organization国家自然科学基金资助项目 (50 2 751 2 8)~~
CSCD IDCSCD:1565735
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/42344
Collection力学所知识产出(1956-2008)
Corresponding Author杨春燕
Recommended Citation
GB/T 7714
杨春燕,白象忠,田振国. 具有圆弧裂纹载流薄板的温度效应分析[J]. 机械强度,2004,26(1):87-91.
APA 杨春燕,白象忠,&田振国.(2004).具有圆弧裂纹载流薄板的温度效应分析.机械强度,26(1),87-91.
MLA 杨春燕,et al."具有圆弧裂纹载流薄板的温度效应分析".机械强度 26.1(2004):87-91.
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