IMECH-IR  > 非线性力学国家重点实验室
薄膜/基体的热失配致界面层裂研究
张东波; 魏悦广
Source Publication损伤、断裂与微纳米力学进展:损伤、断裂与微纳米力学研讨会论文集.清华大学出版社,2009,p.39-45
2009-08-20
Pages39-45
Conference Name损伤、断裂与微纳米力学进展:损伤、断裂与微纳米力学研讨会
Conference Date2009-08-20
Conference Place中国北京
Abstract本文研究了热失配引起的残余应力作用下的薄膜/基体体系的界面层裂特征。假设薄膜和基体材料分别为弹塑性材料和弹性材料,薄膜/基体界面的层裂采用复合型的粘聚力模型来刻画。研究了对应不同薄膜材料参数和不同界面参数情况的界面层裂发生机制,给出了层裂发生时临界温度荷载与薄膜/基体几何参数、材料参数以及模型参数之间的关系。
Keyword薄膜/基体 界面层裂 热失配 粘聚力模型
Funding Organization国家自然科学基金项目(项目编号:10672163,90816004)的资助
Language中文
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/43047
Collection非线性力学国家重点实验室
Corresponding Author张东波
Recommended Citation
GB/T 7714
张东波,魏悦广. 薄膜/基体的热失配致界面层裂研究[C]:清华大学出版社,2009:39-45.
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