|Dynamic behaviors of mode III interfacial crack under a constant loading rate|
|Chen SH(陈少华); Gao HJ(高华健); Chen SH
|Source Publication||Continuum Mechanics and Thermodynamics
|Abstract||In an earlier study on intersonic crack propagation, Gao et al. (J. Mech. Phys. Solids 49: 2113-2132, 2001) described molecular dynamics simulations and continuum analysis of the dynamic behaviors of a mode II dominated crack moving along a weak plane under a constant loading rate. The crack was observed to initiate its motion at a critical time after the onset of loading, at which it is rapidly accelerated to the Rayleigh wave speed and propagates at this speed for a finite time interval until an intersonic daughter crack is nucleated at a peak stress at a finite distance ahead of the original crack tip. The present article aims to analyze this behavior for a mode III crack moving along a bi-material interface subject to a constant loading rate. We begin with a crack in an initially stress-free bi-material subject to a steadily increasing stress. The crack initiates its motion at a critical time governed by the Griffith criterion. After crack initiation, two scenarios of crack propagation are investigated: the first one is that the crack moves at a constant subsonic velocity; the second one is that the crack moves at the lower shear wave speed of the two materials. In the first scenario, the shear stress ahead of the crack tip is singular with exponent -1/2, as expected; in the second scenario, the stress singularity vanishes but a peak stress is found to emerge at a distance ahead of the moving crack tip. In the latter case, a daughter crack supersonic with respect to the softer medium can be expected to emerge ahead of the initial crack once the peak stress reaches the cohesive strength of the interface.|
|Keyword||Mode Iii Interfacial Crack
Constant Loading Rate
Simulating Materials Failure
Worlds Fastest Computer
Intersonic Shear Cracks
One Billion Atoms
|WOS Keyword||SIMULATING MATERIALS FAILURE
; WORLDS FASTEST COMPUTER
; INTERSONIC SHEAR CRACKS
; ONE BILLION ATOMS
; BIMATERIAL INTERFACE
; TRANSIENT ANALYSIS
; VARIABLE VELOCITY
; HOMOGENEOUS MEDIA
; TRANSITION WAVES
|WOS Research Area||Thermodynamics
|Funding Organization||Ministry of Education of China, NSFC [10972220, 10732050, 10721202]
; CAS [KJCX2-YW-M04]
|Corresponding Author||Chen SH|
Chen SH,Gao HJ,Chen SH. Dynamic behaviors of mode III interfacial crack under a constant loading rate[J]. Continuum Mechanics and Thermodynamics,2010,22(6-8):515-530.
陈少华,高华健,&Chen SH.(2010).Dynamic behaviors of mode III interfacial crack under a constant loading rate.Continuum Mechanics and Thermodynamics,22(6-8),515-530.
陈少华,et al."Dynamic behaviors of mode III interfacial crack under a constant loading rate".Continuum Mechanics and Thermodynamics 22.6-8(2010):515-530.
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