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Dynamic behaviors of mode III interfacial crack under a constant loading rate
Chen SH(陈少华); Gao HJ(高华健); Chen SH
Source PublicationContinuum Mechanics and Thermodynamics
2010
Volume22Issue:6-8Pages:515-530
ISSN0935-1175
AbstractIn an earlier study on intersonic crack propagation, Gao et al. (J. Mech. Phys. Solids 49: 2113-2132, 2001) described molecular dynamics simulations and continuum analysis of the dynamic behaviors of a mode II dominated crack moving along a weak plane under a constant loading rate. The crack was observed to initiate its motion at a critical time after the onset of loading, at which it is rapidly accelerated to the Rayleigh wave speed and propagates at this speed for a finite time interval until an intersonic daughter crack is nucleated at a peak stress at a finite distance ahead of the original crack tip. The present article aims to analyze this behavior for a mode III crack moving along a bi-material interface subject to a constant loading rate. We begin with a crack in an initially stress-free bi-material subject to a steadily increasing stress. The crack initiates its motion at a critical time governed by the Griffith criterion. After crack initiation, two scenarios of crack propagation are investigated: the first one is that the crack moves at a constant subsonic velocity; the second one is that the crack moves at the lower shear wave speed of the two materials. In the first scenario, the shear stress ahead of the crack tip is singular with exponent -1/2, as expected; in the second scenario, the stress singularity vanishes but a peak stress is found to emerge at a distance ahead of the moving crack tip. In the latter case, a daughter crack supersonic with respect to the softer medium can be expected to emerge ahead of the initial crack once the peak stress reaches the cohesive strength of the interface.
KeywordMode Iii Interfacial Crack Constant Loading Rate Subsonic Supersonic Daughter Crack Simulating Materials Failure Worlds Fastest Computer Intersonic Shear Cracks One Billion Atoms Bimaterial Interface Transient Analysis Variable Velocity Homogeneous Media Transition Waves Phase-transition
DOI10.1007/s00161-010-0141-1
URL查看原文
Indexed BySCI
Language英语
WOS IDWOS:000282698300007
WOS KeywordSIMULATING MATERIALS FAILURE ; WORLDS FASTEST COMPUTER ; INTERSONIC SHEAR CRACKS ; ONE BILLION ATOMS ; BIMATERIAL INTERFACE ; TRANSIENT ANALYSIS ; VARIABLE VELOCITY ; HOMOGENEOUS MEDIA ; TRANSITION WAVES ; PHASE-TRANSITION
WOS Research AreaThermodynamics ; Mechanics
WOS SubjectThermodynamics ; Mechanics
Funding OrganizationMinistry of Education of China, NSFC [10972220, 10732050, 10721202] ; CAS [KJCX2-YW-M04]
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Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/43463
Collection非线性力学国家重点实验室
Corresponding AuthorChen SH
Recommended Citation
GB/T 7714
Chen SH,Gao HJ,Chen SH. Dynamic behaviors of mode III interfacial crack under a constant loading rate[J]. Continuum Mechanics and Thermodynamics,2010,22(6-8):515-530.
APA 陈少华,高华健,&Chen SH.(2010).Dynamic behaviors of mode III interfacial crack under a constant loading rate.Continuum Mechanics and Thermodynamics,22(6-8),515-530.
MLA 陈少华,et al."Dynamic behaviors of mode III interfacial crack under a constant loading rate".Continuum Mechanics and Thermodynamics 22.6-8(2010):515-530.
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