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Influence of processing temperature on microstructure and microhardness of copper subjected to high-pressure torsion
Xie ZL(谢子令); Xie JJ(谢季佳); Hong YS(洪友士); Wu XL(武晓雷); Xie ZL
发表期刊Science China-Technological Sciences
2010
卷号53期号:6页码:1534-1539
ISSN1674-7321
摘要Cu samples were subjected to high-pressure torsion (HPT) with up to 6 turns at room temperature (RT) and liquid nitrogen temperature (LNT), respectively. The effects of temperature on grain refinement and microhardness variation were investigated. For the samples after HPT processing at RT, the grain size reduced from 43 mu m to 265 nm, and the Vickers microhardness increased from HV52 to HV140. However, for the samples after HPT processing at LNT, the value of microhardness reached its maximum of HV150 near the center of the sample and it decreased to HV80 at the periphery region. Microstructure observations revealed that HPT straining at LNT induced lamellar structures with thickness less than 100 nm appearing near the central region of the sample, but further deformation induced an inhomogeneous distribution of grain sizes, with submicrometer-sized grains embedded inside micrometer-sized grains. The submicrometer-sized grains with high dislocation density indicated their nonequilibrium nature. On the contrary, the micrometer-sized grains were nearly free of dislocation, without obvious deformation trace remaining in them. These images demonstrated that the appearance of micrometer-sized grains is the result of abnormal grain growth of the deformed fine grains.
DOI10.1007/s11431-010-3157-7
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收录类别SCI
语种英语
WOS记录号WOS:000278839200014
关键词[WOS]NANOCRYSTALLINE ; DEFORMATION ; CU ; EVOLUTION ; METALS ; ALLOY
WOS研究方向Engineering ; Materials Science
WOS类目Engineering, Multidisciplinary ; Materials Science, Multidisciplinary
项目资助者National Natural Science Foundation of China [10721202, 10772178, 50571110]
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被引频次:9[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://dspace.imech.ac.cn/handle/311007/43497
专题非线性力学国家重点实验室
通讯作者Xie ZL
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GB/T 7714
Xie ZL,Xie JJ,Hong YS,et al. Influence of processing temperature on microstructure and microhardness of copper subjected to high-pressure torsion[J]. Science China-Technological Sciences,2010,53,6,:1534-1539.
APA 谢子令,谢季佳,洪友士,武晓雷,&Xie ZL.(2010).Influence of processing temperature on microstructure and microhardness of copper subjected to high-pressure torsion.Science China-Technological Sciences,53(6),1534-1539.
MLA 谢子令,et al."Influence of processing temperature on microstructure and microhardness of copper subjected to high-pressure torsion".Science China-Technological Sciences 53.6(2010):1534-1539.
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