A micromechanical model for deformation behavior of nanocrystalline copper

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	A micromechanical model for deformation behavior of nanocrystalline copper
	Lan JX(兰姣霞); Wu YZ(吴永中); Hong YS(洪友士); Lan JX
会议录名称	NEW MATERIALS AND ADVANCED MATERIALS
	2011
页码	772-777
会议名称	2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
会议日期	NOV 06-08, 2010
会议地点	Shenzhen, China
摘要	Molecular dynamics simulations have show that nanocrystalline (NC) materials can be treated as composite materials consisting of two phases of grain and grain boundary. In this paper, the incremental stress-strain relation is derived based on deformation mechanism of NC materials and internal variable theory from micromechanics point of view. The developed model is exemplified by the pure copper subjected to uniaxial tension. Implicated iteration algorithm is then employed to obtain the stress-strain relation. Moreover, the effects of grain shape and statistical distribution of grain sizes are also discussed, and predicted results are compared with experimental values to verify the model.
关键词	Algorithms Copper Deformation Grain Boundaries Grain Size And Shape Materials Micromechanics Molecular Dynamics Strain Energy Deformation Behavior Deformation Mechanism Developed Model Experimental Values Grain Shapes Grain Size Internal Variable Theory Iteration Algorithms Micromechanical Model Molecular Dynamics Simulations Nanocrystalline Copper Nanocrystallines Pure Copper Statistical Distribution Stress Strain Relation Uniaxial Tensions
WOS记录号	WOS:000288114200146
课题组名称	LNM金属材料微结构与力学性能
ISBN号	9780878492039
URL	查看原文
收录类别	CPCI-S ; EI
语种	英语
引用统计
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/46819
专题	非线性力学国家重点实验室
通讯作者	Lan JX
推荐引用方式 GB/T 7714	Lan JX,Wu YZ,Hong YS,et al. A micromechanical model for deformation behavior of nanocrystalline copper[C]NEW MATERIALS AND ADVANCED MATERIALS,2011:772-777.

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