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A micromechanical model for deformation behavior of nanocrystalline copper
Lan JX(兰姣霞); Wu YZ(吴永中); Hong YS(洪友士); Lan JX
Conference Name2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010
Conference DateNOV 06-08, 2010
Conference PlaceShenzhen, China
AbstractMolecular dynamics simulations have show that nanocrystalline (NC) materials can be treated as composite materials consisting of two phases of grain and grain boundary. In this paper, the incremental stress-strain relation is derived based on deformation mechanism of NC materials and internal variable theory from micromechanics point of view. The developed model is exemplified by the pure copper subjected to uniaxial tension. Implicated iteration algorithm is then employed to obtain the stress-strain relation. Moreover, the effects of grain shape and statistical distribution of grain sizes are also discussed, and predicted results are compared with experimental values to verify the model.
KeywordAlgorithms Copper Deformation Grain Boundaries Grain Size And Shape Materials Micromechanics Molecular Dynamics Strain Energy Deformation Behavior Deformation Mechanism Developed Model Experimental Values Grain Shapes Grain Size Internal Variable Theory Iteration Algorithms Micromechanical Model Molecular Dynamics Simulations Nanocrystalline Copper Nanocrystallines Pure Copper Statistical Distribution Stress Strain Relation Uniaxial Tensions
WOS IDWOS:000288114200146
Indexed ByCPCI-S ; EI
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Document Type会议论文
Corresponding AuthorLan JX
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GB/T 7714
Lan JX,Wu YZ,Hong YS,et al. A micromechanical model for deformation behavior of nanocrystalline copper[C]NEW MATERIALS AND ADVANCED MATERIALS,2011:772-777.
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