IMECH-IR  > 力学所知识产出(1956-2008)
点焊薄片应变传感器的数值分析与实验研究
徐永君; 唐俊武; 赵清清; 王晓博
Source Publication2008全国MTS断裂测试研讨会论文集
2008
Pages110-114
Conference Name2008全国MTS断裂测试研讨会
Conference Date2008-10-9
Conference Place中国成都
Abstract工程实际中,许多现场环境不适合应变片的粘贴、密封、养护以及工期要求等,需要将应变粘贴、养护及密封工作提前到实验室进行。点焊薄片应变传感器能够保证焊接过程中不产生引起应变片损坏的热量。本文通过对电阻点焊和氩弧点焊两种薄片应变传感器进行试验研究和数值分析证明了点焊薄片应变传感器具有很好的传递性能和疲劳性能,可以应用于复杂环境情况下的应变测量。
Keyword应变传感器 点焊 传递性能
Department力学所
Language中文
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/48185
Collection力学所知识产出(1956-2008)
Recommended Citation
GB/T 7714
徐永君,唐俊武,赵清清,等. 点焊薄片应变传感器的数值分析与实验研究[C],2008:110-114.
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