IMECH-IR  > 先进制造工艺力学重点实验室
Film residual stress assessment method via temporarily thermal relaxation
Cheng XX(程欣欣); Wu CW(吴臣武)
Source PublicationExperimental and Applied Mechanics - Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics
2013
Pages267-276
Conference Name2012 Annual Conference on Experimental and Applied Mechanics
Conference DateJUN 11-14, 2012
Conference PlaceCosta Mesa, CA, United states
AbstractThe concept of temporarily thermal relaxation is extended theoretically to assess the film residual stress. First, the contribution of the initial stress to the observable displacement field is separated with eliminating the thermal expansion effect of the material. Then, the residual stress is inversely derived through the displacement increment. Finally, finite element analysis was carried out to provide numerical description of the partial relieve of the residual stress.
KeywordFilm Residual Stress Assessment Temporarily Thermal Relaxation
Department先进制造工艺力学重点实验室
ISBN978-1-4614-4225-7
URL查看原文
Indexed ByEI
Language英语
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/48265
Collection先进制造工艺力学重点实验室
Corresponding AuthorWu CW(吴臣武)
Recommended Citation
GB/T 7714
Cheng XX,Wu CW. Film residual stress assessment method via temporarily thermal relaxation[C]:SPRINGER NEW YORK,2013:267-276.
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