Film residual stress assessment method via temporarily thermal relaxation

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	Film residual stress assessment method via temporarily thermal relaxation
	Cheng XX(程欣欣); Wu CW(吴臣武)
会议录名称	Experimental and Applied Mechanics - Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics
	2013
页码	267-276
会议名称	2012 Annual Conference on Experimental and Applied Mechanics
会议日期	JUN 11-14, 2012
会议地点	Costa Mesa, CA, United states
摘要	The concept of temporarily thermal relaxation is extended theoretically to assess the film residual stress. First, the contribution of the initial stress to the observable displacement field is separated with eliminating the thermal expansion effect of the material. Then, the residual stress is inversely derived through the displacement increment. Finally, finite element analysis was carried out to provide numerical description of the partial relieve of the residual stress.
关键词	Film Residual Stress Assessment Temporarily Thermal Relaxation
课题组名称	先进制造工艺力学重点实验室
ISBN号	978-1-4614-4225-7
URL	查看原文
收录类别	EI
语种	英语
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/48265
专题	先进制造工艺力学实验室
通讯作者	Wu CW(吴臣武)
推荐引用方式 GB/T 7714	Cheng XX,Wu CW. Film residual stress assessment method via temporarily thermal relaxation[C]Experimental and Applied Mechanics - Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics,2013:267-276.

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