Peeling behavior of a viscoelastic thin-film on a rigid substrate

IMECH-IR > 非线性力学国家重点实验室

	Peeling behavior of a viscoelastic thin-film on a rigid substrate
	Peng ZL(彭志龙); Wang C(王琮); Chen L(陈磊); Chen SH(陈少华); Chen, SH (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100190, Peoples R China.
发表期刊	International Journal of Solids and Structures
	2014
卷号	51 期号:25-26 页码:4596–4603
ISSN	0020-7683
摘要	In order to study the adhesion mechanism of a viscoelastic thin-film on a substrate, peeling experiment of a viscoelastic polyvinylchloride (PVC) thin-film on a rigid substrate (glass) is carried out. The effects of peeling rate, peeling angle, film thickness, surface roughness and the interfacial adhesive on the peel-off force are considered. It is found that both the viscoelastic properties of the film and the interfacial adhesive contribute to the rate-dependent peel-off force. For a fixed peeling rate, the peel-off force decreases with the increasing peeling angle. Increasing film thickness or substrate roughness leads to an increase of the peel-off force. Viscoelastic energy release rate in the present experiment can be further predicted by adopting a recently published theoretical model. It is shown that the energy release rate increases with the increase of peeling rates or peeling angles. The results in the present paper should be helpful for understanding the adhesion mechanism of a viscoelastic thin-film.
关键词	Viscoelastic Thin-film Peel-test Peel-off Force Peeling Rate Energy Release Rate
URL	查看原文
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000345470400036
项目资助者	The work reported here is supported by NSFC through Grants #11302228, #11125211, #11372317 and the 973 Nano-project (2012CB937500).
课题组名称	LNM仿生材料与固体的微尺度力学
论文分区	一类/力学重要期刊
引用统计	被引频次：66[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/49369
专题	非线性力学国家重点实验室
通讯作者	Chen, SH (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100190, Peoples R China.
推荐引用方式 GB/T 7714	Peng ZL,Wang C,Chen L,et al. Peeling behavior of a viscoelastic thin-film on a rigid substrate[J]. International Journal of Solids and Structures,2014,51,25-26,:4596–4603.
APA	Peng ZL,Wang C,Chen L,Chen SH,&Chen, SH .(2014).Peeling behavior of a viscoelastic thin-film on a rigid substrate.International Journal of Solids and Structures,51(25-26),4596–4603.
MLA	Peng ZL,et al."Peeling behavior of a viscoelastic thin-film on a rigid substrate".International Journal of Solids and Structures 51.25-26(2014):4596–4603.

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