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Effect of bending stiffness on the peeling behavior of an elastic thin film on a rigid substrate
Peng ZL(彭志龙); Chen SH(陈少华); Chen, SH (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Source PublicationPHYSICAL REVIEW E
2015-04-03
Volume91Issue:4Pages:42401
ISSN1539-3755
AbstractInspired by the experimental observation that the maximum peeling force of elastic films on rigid substrates does not always emerge at the steady-state peeling stage, but sometimes at the initial one, a theoretical model is established in this paper, in which not only the effect of the film's bending stiffness on the peeling force is considered, but also the whole peeling process, from the initiation of debonding to the steady-state stage, is characterized. Typical peeling force-displacement curves and deformed profiles of the film reappear for the whole peeling process. For the case of a film with relatively large bending stiffness, the maximum peeling force is found arising at the initial peeling stage and the larger the stiffness of the film, the larger the maximum peeling force is. With the peeling distance increasing, the peeling force is reduced from the maximum to a constant at the steady-state stage. For the case of a film with relatively small stiffness, the peeling force increases monotonically at the initial stage and then achieves a constant as the maximum at the steady-state stage. Furthermore, the peeling forces in the steady-state stage are compared with those of the classical Kendall model. All the theoretical predictions agree well with the existing experimental and numerical observations, from which the maximum peeling force can be predicted precisely no matter what the stiffness of the film is. The results in this paper should be very helpful in the design and assessment of the film-substrate interface.
Subject AreaPhysics, Fluids & Plasmas ; Physics, Mathematical
DOI10.1103/PhysRevE.91.042401
URL查看原文
Indexed BySCI ; EI
Language英语
WOS IDWOS:000352126100004
WOS KeywordZONE MODEL ; ADHESION ; FRACTURE
WOS Research AreaPhysics
WOS SubjectPhysics, Fluids & Plasmas ; Physics, Mathematical
Funding OrganizationNSFC [11302228, 11125211, 11372317] ; 973 Nano Project [2012CB937500]
DepartmentLNM仿生材料与固体的微尺度力学
Classification一类
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Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/49902
Collection非线性力学国家重点实验室
Corresponding AuthorChen, SH (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.
Recommended Citation
GB/T 7714
Peng ZL,Chen SH,Chen, SH . Effect of bending stiffness on the peeling behavior of an elastic thin film on a rigid substrate[J]. PHYSICAL REVIEW E,2015,91(4):42401.
APA 彭志龙,陈少华,&Chen, SH .(2015).Effect of bending stiffness on the peeling behavior of an elastic thin film on a rigid substrate.PHYSICAL REVIEW E,91(4),42401.
MLA 彭志龙,et al."Effect of bending stiffness on the peeling behavior of an elastic thin film on a rigid substrate".PHYSICAL REVIEW E 91.4(2015):42401.
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