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A micromechanical model for deformation behavior of nanocrystalline copper
Lan JX(兰姣霞); Wu YZ(吴永中); Hong YS(洪友士)
Source PublicationAdvanced Materials Research
2011
Volume152-153Pages:772-777
ISSN1022-6680
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Indexed ByEI
Language英语
DepartmentLNM金属材料微结构与力学性能
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/54941
Collection非线性力学国家重点实验室
Recommended Citation
GB/T 7714
Lan JX,Wu YZ,Hong YS. A micromechanical model for deformation behavior of nanocrystalline copper[J]. Advanced Materials Research,2011,152-153:772-777.
APA Lan JX,Wu YZ,&Hong YS.(2011).A micromechanical model for deformation behavior of nanocrystalline copper.Advanced Materials Research,152-153,772-777.
MLA Lan JX,et al."A micromechanical model for deformation behavior of nanocrystalline copper".Advanced Materials Research 152-153(2011):772-777.
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