IMECH-IR  > 力学所知识产出(1956-2008)
Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer
Zhou Y; Yang CS; Chen JA; Ding GF; Wang L; Wang MJ; Zhang YM; Zhang TH(张泰华)
Source PublicationActa Metallurgica Sinica(English Letters)
2004
Volume17Issue:3Pages:247-254
ISSN1006-7191
AbstractMicrobridge testing is used to measure the Young's modulus and residual stresses ofmetallic films. Nickel film microbridges with widths of several hundred microns arefabricated by Microelectromechanical Systems. In order to measure the mechanicalproperties of nickel film microbridges, special sh...
KeywordNickel Film Microbridge Mems Mechanical Property Loadeflection Measurement
Indexed ByEI
Language英语
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/55256
Collection力学所知识产出(1956-2008)
Recommended Citation
GB/T 7714
Zhou Y,Yang CS,Chen JA,et al. Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer[J]. Acta Metallurgica Sinica(English Letters),2004,17(3):247-254.
APA Zhou Y.,Yang CS.,Chen JA.,Ding GF.,Wang L.,...&Zhang TH.(2004).Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer.Acta Metallurgica Sinica(English Letters),17(3),247-254.
MLA Zhou Y,et al."Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer".Acta Metallurgica Sinica(English Letters) 17.3(2004):247-254.
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