Knowledge Management System of Institue of Mechanics, CAS
Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer | |
Zhou Y; Yang CS; Chen JA; Ding GF; Wang L; Wang MJ; Zhang YM; Zhang TH(张泰华) | |
Source Publication | Acta Metallurgica Sinica(English Letters) |
2004 | |
Volume | 17Issue:3Pages:247-254 |
ISSN | 1006-7191 |
Abstract | Microbridge testing is used to measure the Young's modulus and residual stresses ofmetallic films. Nickel film microbridges with widths of several hundred microns arefabricated by Microelectromechanical Systems. In order to measure the mechanicalproperties of nickel film microbridges, special sh... |
Keyword | Nickel Film Microbridge Mems Mechanical Property Loadeflection Measurement |
Indexed By | EI |
Language | 英语 |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/55256 |
Collection | 力学所知识产出(1956-2008) |
Recommended Citation GB/T 7714 | Zhou Y,Yang CS,Chen JA,et al. Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer[J]. Acta Metallurgica Sinica(English Letters),2004,17,3,:247-254. |
APA | Zhou Y.,Yang CS.,Chen JA.,Ding GF.,Wang L.,...&Zhang TH.(2004).Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer.Acta Metallurgica Sinica(English Letters),17(3),247-254. |
MLA | Zhou Y,et al."Microbridge testing of Young's modulus and residual stress of nickel film electroplated on silicon wafer".Acta Metallurgica Sinica(English Letters) 17.3(2004):247-254. |
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jadd135.pdf(475KB) | 期刊论文 | 出版稿 | 开放获取 | CC BY-NC-SA | View Download |
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