IMECH-IR  > 力学所知识产出(1956-2008)
Molecular Dynamics Simulation of Microcrack Healing in Copper
Li S; Gao KW; Qiao LJ; Zhou FX(周富信); Chu WY; Qiao, LJ (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China.
Source PublicationCOMPUTATIONAL MATERIALS SCIENCE
2001
Volume20Issue:2Pages:143-150
ISSN0927-0256
AbstractThe molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress. A center microcrack in Cu crystal could be sealed under a compressive stress or by heating. The role of compressive stress and heating in crack healing was additive. During microcrack healing, dislocation generation and motion occurred. If there were pre-existed dislocations around the microcrack, the critical temperature or compressive stress necessary for microcrack healing would decrease, and the higher the number of dislocations, the lower the critical temperature or compressive stress. The critical temperature necessary for microcrack healing depended upon the orientation of crack plane. For example, the critical temperature of the crack along (001) plane was the lowest, i.e., 770 K. (C) 2001 Elsevier Science B.V. All rights reserved.
KeywordMicrocrack Healing Molecular Dynamics Simulation Dislocation Cu
DOI10.1016/S0927-0256(00)00130-0
Indexed BySCI
Language英语
WOS IDWOS:000166878500001
WOS KeywordTHIN-CRYSTALS ; CRACK-TIP ; NUCLEATION ; METALS
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/58487
Collection力学所知识产出(1956-2008)
Corresponding AuthorQiao, LJ (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China.
Recommended Citation
GB/T 7714
Li S,Gao KW,Qiao LJ,et al. Molecular Dynamics Simulation of Microcrack Healing in Copper[J]. COMPUTATIONAL MATERIALS SCIENCE,2001,20(2):143-150.
APA Li S,Gao KW,Qiao LJ,周富信,Chu WY,&Qiao, LJ .(2001).Molecular Dynamics Simulation of Microcrack Healing in Copper.COMPUTATIONAL MATERIALS SCIENCE,20(2),143-150.
MLA Li S,et al."Molecular Dynamics Simulation of Microcrack Healing in Copper".COMPUTATIONAL MATERIALS SCIENCE 20.2(2001):143-150.
Files in This Item: Download All
File Name/Size DocType Version Access License
JourArSuppl2016-207.(1114KB)期刊论文作者接受稿开放获取CC BY-NC-SAView Download
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Li S]'s Articles
[Gao KW]'s Articles
[Qiao LJ]'s Articles
Baidu academic
Similar articles in Baidu academic
[Li S]'s Articles
[Gao KW]'s Articles
[Qiao LJ]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Li S]'s Articles
[Gao KW]'s Articles
[Qiao LJ]'s Articles
Terms of Use
No data!
Social Bookmark/Share
File name: JourArSuppl2016-207.pdf
Format: Adobe PDF
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.