Molecular Dynamics Simulation of Microcrack Healing in Copper

doi:10.1016/S0927-0256(00)00130-0

IMECH-IR > 力学所知识产出(1956-2008)

	Molecular Dynamics Simulation of Microcrack Healing in Copper
	Li S; Gao KW; Qiao LJ; Zhou FX(周富信); Chu WY; Qiao, LJ (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China.
发表期刊	COMPUTATIONAL MATERIALS SCIENCE
	2001
卷号	20 期号:2 页码:143-150
ISSN	0927-0256
摘要	The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress. A center microcrack in Cu crystal could be sealed under a compressive stress or by heating. The role of compressive stress and heating in crack healing was additive. During microcrack healing, dislocation generation and motion occurred. If there were pre-existed dislocations around the microcrack, the critical temperature or compressive stress necessary for microcrack healing would decrease, and the higher the number of dislocations, the lower the critical temperature or compressive stress. The critical temperature necessary for microcrack healing depended upon the orientation of crack plane. For example, the critical temperature of the crack along (001) plane was the lowest, i.e., 770 K. (C) 2001 Elsevier Science B.V. All rights reserved.
关键词	Microcrack Healing Molecular Dynamics Simulation Dislocation Cu
DOI	10.1016/S0927-0256(00)00130-0
收录类别	SCI
语种	英语
WOS记录号	WOS:000166878500001
关键词[WOS]	THIN-CRYSTALS ; CRACK-TIP ; NUCLEATION ; METALS
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
引用统计	被引频次：14[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/58487
专题	力学所知识产出(1956-2008)
通讯作者	Qiao, LJ (reprint author), Univ Sci & Technol Beijing, Dept Mat Phys, Beijing 100083, Peoples R China.
推荐引用方式 GB/T 7714	Li S,Gao KW,Qiao LJ,et al. Molecular Dynamics Simulation of Microcrack Healing in Copper[J]. COMPUTATIONAL MATERIALS SCIENCE,2001,20,2,:143-150.
APA	Li S,Gao KW,Qiao LJ,周富信,Chu WY,&Qiao, LJ .(2001).Molecular Dynamics Simulation of Microcrack Healing in Copper.COMPUTATIONAL MATERIALS SCIENCE,20(2),143-150.
MLA	Li S,et al."Molecular Dynamics Simulation of Microcrack Healing in Copper".COMPUTATIONAL MATERIALS SCIENCE 20.2(2001):143-150.

条目包含的文件		下载所有文件
文件名称/大小	文献类型	版本类型	开放类型	使用许可
JourArSuppl2016-207.（1114KB）	期刊论文	作者接受稿	开放获取	CC BY-NC-SA	浏览下载