Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package

doi:10.1016/S0263-8223(97)00088-3

IMECH-IR > 力学所知识产出(1956-2008)

	Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package
	Wu CML; Lai JKL; Wu YL(吴永礼); Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong.
发表期刊	COMPOSITE STRUCTURES
	1997
卷号	38 期号:1-4 页码:525-530
ISSN	0263-8223
摘要	A tape automated bonded (TAB) package is basically a composite structure. A three-dimensional finite element fracture analysis was performed to evaluate the effects of cracks in a TAB package under thermal cycling conditions. The lead-tin solder in the outer lead bond as well as the copper beam lead were taken as elasto-plastic materials. Interface cracks between the copper beam lead and the solder were included in the analysis. It was found that the prescribed cracks created new sources of stress concentrations, which are fairly mild. This result showed that the configuration of the outer lead bonds in TAB packages is generally resilient to thermal cycling, even with the presence of defects such as cracks. (C) 1997 Elsevier Science Ltd.
DOI	10.1016/S0263-8223(97)00088-3
收录类别	SCI
语种	英语
WOS记录号	WOS:000071253500054
关键词[WOS]	INTERCONNECTIONS
WOS研究方向	Materials Science
WOS类目	Materials Science, Composites
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/58495
专题	力学所知识产出(1956-2008)
通讯作者	Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, 83 Tat Chee Ave, Hong Kong, Hong Kong.
推荐引用方式 GB/T 7714	Wu CML,Lai JKL,Wu YL,et al. Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package[J]. COMPOSITE STRUCTURES,1997,38,1-4,:525-530.
APA	Wu CML,Lai JKL,吴永礼,&Wu, CML .(1997).Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package.COMPOSITE STRUCTURES,38(1-4),525-530.
MLA	Wu CML,et al."Effect of Cracks on Thermal Stress and Strain of A Tape Automated Bonded Package".COMPOSITE STRUCTURES 38.1-4(1997):525-530.

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