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Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate
Chen PJ; Chen SH(陈少华); Yao Y(姚寅); Chen, PJ (reprint author), China Univ Min & Technol, Sch Mech & Civil Engn, State Key Lab Geomech & Deep Underground Engn, Xuzhou 221116, Jiangsu, Peoples R China.
Source PublicationJOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
2016-02
Volume83Issue:2Pages:21007
ISSN0021-8936
AbstractThe contact behavior of an elastic film subjected to a mismatch strain on a finite-thickness graded substrate is investigated, in which the contact interface is assumed to be nonslipping and the shear modulus of the substrate varies exponentially in the thickness direction. The Fourier transform method is adopted in order to reduce the governing partial differential equations to integral ones. With the help of numerical calculation, the interfacial shear stress, the internal normal stress in the film and the stress intensity factors are predicted for cases with different material parameters and geometric ones, including the modulus ratio of the film to the substrate, the inhomogeneous feature of the graded substrate, as well as the profile of the contacting film. All the physical predictions can be used to estimate the potential failure modes of the film-substrate interface. Furthermore, it is found that the result of a finite-thickness model is significantly different from the prediction of a generally adopted half-plane one. The study should be helpful for the design of film-substrate systems in real applications.
KeywordContact Mechanics Nonslipping Contact Thin Film Graded Substrate Finite-thickness
DOI10.1115/1.4031936
URL查看原文
Indexed BySCI ; EI
Language英语
WOS IDWOS:000367373500007
WOS KeywordELASTIC HALF-SPACE ; ADHESIVE CONTACT ; THIN-FILM ; HEAT-GENERATION ; MECHANICS ; EDGE ; SOLIDS ; PLANE ; REINFORCEMENT ; INDENTATION
WOS Research AreaMechanics
WOS SubjectMechanics
Funding OrganizationP.C. thanks the support of China Postdoctoral Science Foundation Funded Project (No. 2015M580486), NSFC (No. 11402292), Natural Science Foundation of Jiangsu Province (No. BK20140179), Jiangsu Planned Projects for Postdoctoral Research Funds (No. 1501009B), the Fundamental Research Funds for the Central Universities (No. 2014QNA73). S.C. gratefully acknowledges the support by the NSFC (Nos. 11372317 and 11125211), the Nano-project (2012CB937500), and the CAS/SAFEA International Partnership Program for Creative Research Teams.
DepartmentLNM仿生材料与固体的微尺度力学
Classification一类/力学重要期刊
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Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/58651
Collection非线性力学国家重点实验室
Corresponding AuthorChen, PJ (reprint author), China Univ Min & Technol, Sch Mech & Civil Engn, State Key Lab Geomech & Deep Underground Engn, Xuzhou 221116, Jiangsu, Peoples R China.
Recommended Citation
GB/T 7714
Chen PJ,Chen SH,Yao Y,et al. Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate[J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,2016,83(2):21007.
APA Chen PJ,Chen SH,Yao Y,&Chen, PJ .(2016).Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate.JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,83(2),21007.
MLA Chen PJ,et al."Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate".JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME 83.2(2016):21007.
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