Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate

doi:10.1115/1.4031936

IMECH-IR > 非线性力学国家重点实验室

	Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate
	Chen PJ; Chen SH(陈少华); Yao Y(姚寅); Chen, PJ (reprint author), China Univ Min & Technol, Sch Mech & Civil Engn, State Key Lab Geomech & Deep Underground Engn, Xuzhou 221116, Jiangsu, Peoples R China.
发表期刊	JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
	2016-02
卷号	83 期号:2 页码:21007
ISSN	0021-8936
摘要	The contact behavior of an elastic film subjected to a mismatch strain on a finite-thickness graded substrate is investigated, in which the contact interface is assumed to be nonslipping and the shear modulus of the substrate varies exponentially in the thickness direction. The Fourier transform method is adopted in order to reduce the governing partial differential equations to integral ones. With the help of numerical calculation, the interfacial shear stress, the internal normal stress in the film and the stress intensity factors are predicted for cases with different material parameters and geometric ones, including the modulus ratio of the film to the substrate, the inhomogeneous feature of the graded substrate, as well as the profile of the contacting film. All the physical predictions can be used to estimate the potential failure modes of the film-substrate interface. Furthermore, it is found that the result of a finite-thickness model is significantly different from the prediction of a generally adopted half-plane one. The study should be helpful for the design of film-substrate systems in real applications.
关键词	Contact Mechanics Nonslipping Contact Thin Film Graded Substrate Finite-thickness
DOI	10.1115/1.4031936
URL	查看原文
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000367373500007
关键词[WOS]	ELASTIC HALF-SPACE ; ADHESIVE CONTACT ; THIN-FILM ; HEAT-GENERATION ; MECHANICS ; EDGE ; SOLIDS ; PLANE ; REINFORCEMENT ; INDENTATION
WOS研究方向	Mechanics
WOS类目	Mechanics
项目资助者	P.C. thanks the support of China Postdoctoral Science Foundation Funded Project (No. 2015M580486), NSFC (No. 11402292), Natural Science Foundation of Jiangsu Province (No. BK20140179), Jiangsu Planned Projects for Postdoctoral Research Funds (No. 1501009B), the Fundamental Research Funds for the Central Universities (No. 2014QNA73). S.C. gratefully acknowledges the support by the NSFC (Nos. 11372317 and 11125211), the Nano-project (2012CB937500), and the CAS/SAFEA International Partnership Program for Creative Research Teams.
课题组名称	LNM仿生材料与固体的微尺度力学
论文分区	一类/力学重要期刊
引用统计	被引频次：27[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/58651
专题	非线性力学国家重点实验室
通讯作者	Chen, PJ (reprint author), China Univ Min & Technol, Sch Mech & Civil Engn, State Key Lab Geomech & Deep Underground Engn, Xuzhou 221116, Jiangsu, Peoples R China.
推荐引用方式 GB/T 7714	Chen PJ,Chen SH,Yao Y,et al. Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate[J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,2016,83,2,:21007.
APA	Chen PJ,Chen SH,Yao Y,&Chen, PJ .(2016).Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate.JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,83(2),21007.
MLA	Chen PJ,et al."Nonslipping Contact Between a Mismatch Film and a Finite-Thickness Graded Substrate".JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME 83.2(2016):21007.

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