Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate

IMECH-IR > 力学所知识产出(1956-2008)

	Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate
	Wei YG(魏悦广); Zhao HF; Shu SQ; Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
会议录名称	IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials
	2007
会议名称	IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials
会议日期	JUN 27-30, 2005
会议地点	Beijing, PEOPLES R CHINA
摘要	Peeling experiments for aluminum thin film along the Al2O3 substrate are carried out, and the variations of external driving force (energy release rate) at the steady-state delamination of the thin film in the metal film/ceramic substrate system are measured. Additionally, theoretical modeling for the thin film delamination is also performed. Based on the bending model, three double-parameter criteria are used. Three double-parameter criteria include: (1) the interfacial fracture toughness and the separation strength, (2) the interfacial fracture toughness and the interfacial crack tip slope angle of thin film, and (3) the interfacial fracture toughness and the critical von Mises effective strain of thin film-at crack tip. Based on the three double-parameter criteria, the thin film nonlinear peeling problems are solved analytically for each case. The results show that the solutions of thin film nonlinear peeling based on the bending model are very sensitive to the model parameter selections. Through analyses and comparisons to different solutions, a connection between solutions based on the bending models and based on the two-dimensional elastic-plastic finite element analysis is obtained. The effective regions of each model can be specified through comparing the present experimental result with model solutions.
WOS记录号	WOS:000245400900007
ISBN号	978-1-4020-5623-9
收录类别	CPCI-S ; EI
语种	英语
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/58889
专题	力学所知识产出(1956-2008)
通讯作者	Wei, YG (reprint author), Chinese Acad Sci, LNM, Inst Mech, Beijing 100080, Peoples R China.
推荐引用方式 GB/T 7714	Wei YG,Zhao HF,Shu SQ,et al. Measurements and simulations of interface behavior in metal thin film peeling along ceramic substrate[C]IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials,2007.

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