IMECH-IR  > 非线性力学国家重点实验室
Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics
Li S; Su YW(苏业旺); Li R; Su, YW (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.; Su, YW (reprint author), Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA.; Su, YW (reprint author), Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA.; Li, R (reprint author), Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China.
Source PublicationPROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES
2016
Volume472Issue:2190Pages:20160087
ISSN1364-5021
AbstractMulti-layer structures with soft (compliant) interlayers have been widely used in flexible electronics and photonics as an effective design for reducing interactions among the hard (stiff) layers and thus avoiding the premature failure of an entire device. The analytic model for bending of such a structure has not been well established due to its complex mechanical behaviour. Here, we present a rational analytic model, without any parameter fitting, to study the bending of a multilayer structure on a cylinder, which is often regarded as an important approach to mechanical reliability testing of flexible electronics and photonics. For the first time, our model quantitatively reveals that, as the key for accurate strain control, the splitting of the neutral mechanical plane depends not only on the relative thickness of the middle layer, but also on the length-to-thickness ratio of the multi-layer structure. The model accurately captures the key quantities, including the axial strains in the top and bottom layers, the shear strain in the middle layer and the locations of the neutral mechanical planes of the top and bottom layers. The effects of the length of the multi-layer and the thickness of the middle layer are elaborated. This work is very useful for the design of multi-layer structure-based flexible electronics and photonics.
KeywordNeutral Mechanical Plane Multi-layer Structure Flexible Electronics Structure Design
DOI10.1098/rspa.2016.0087
URL查看原文
Indexed BySCI ; EI
Language英语
WOS IDWOS:000379726800018
WOS Keywordneutral mechanical plane ; multi-layer structure ; flexible electronics ; structure design
WOS Research AreaScience & Technology - Other Topics
WOS SubjectMultidisciplinary Sciences
Funding OrganizationY.S. and R.L. acknowledge support from the National Natural Science Foundation of China (grant nos 11572323 and 11302038). Y.S. also acknowledges support from the Chinese Academy of Sciences via the 'Hundred Talent program'.
DepartmentLNM苏业旺
Classification二类
RankingTrue
Citation statistics
Cited Times:11[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/59572
Collection非线性力学国家重点实验室
Corresponding AuthorSu, YW (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.; Su, YW (reprint author), Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA.; Su, YW (reprint author), Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA.; Li, R (reprint author), Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China.
Recommended Citation
GB/T 7714
Li S,Su YW,Li R,et al. Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics[J]. PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES,2016,472(2190):20160087.
APA Li S.,苏业旺.,Li R.,Su, YW .,Su, YW .,...&Li, R .(2016).Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics.PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES,472(2190),20160087.
MLA Li S,et al."Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics".PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES 472.2190(2016):20160087.
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