IMECH-IR  > 非线性力学国家重点实验室
Effect of relative humidity on the peeling behavior of a thin film on a rigid substrate
Peng ZL(彭志龙); Wang C(王琮); Yang YZ; Chen SH(陈少华); Chen, SH (reprint author), Beijing Inst Technol, Inst Adv Struct Technol, Beijing 100081, Peoples R China.
Source PublicationPHYSICAL REVIEW E
2016
Volume94Issue:3Pages:32801
ISSN2470-0045
AbstractInspired by gecko adhesion in humid environments, a modified Kendall's model is established in order to investigate the effect of relative humidity on the interfacial peeling behavior of a thin film adhering on a rigid substrate. When the humidity is less than 90%, a monolayer of water molecules adsorbed on the substrate surface induces a strong disjoining pressure at the interface. As a result, the steady-state peel-off force between the thin film and substrate is significantly enhanced. When the humidity is greater than 90%, water molecules condense into water droplets. Four different peeling models are established on this occasion, depending on the surface wettability of the film and substrate. It is found that the steady-state peel-off force is influenced by the water meniscus in a complicated manner, which is either enhanced or reduced by the water capillarity comparing to that predicted by the classical Kendall's model, i.e., a dry peeling model. It should be noted that, at the vicinity of the wetting transition, the peel-off force of the four models can be reduced to an identical one, which means the four peeling models can transit from one to another continuously. The present model, as an extension of the classical Kendall's one, should be useful not only for understanding gecko adhesion in humid environments, but also for analyzing interface behaviors of a film-substrate system in real applications.
DOI10.1103/PhysRevE.94.032801
URL查看原文
Indexed BySCI ; EI
Language英语
WOS IDWOS:000383243600007
WOS Research AreaPhysics
WOS SubjectPhysics, Fluids & Plasmas ; Physics, Mathematical
Funding OrganizationThe work reported here is supported by NSFC through Grants No. 11302228, No. 11372317, and No. 11532013, and the 973 Nano-project (2012CB937500). We appreciate the anonymous reviewers for their valuable suggestions.
DepartmentLNM仿生材料与固体的微尺度力学
Classification一类
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/59723
Collection非线性力学国家重点实验室
Corresponding AuthorChen, SH (reprint author), Beijing Inst Technol, Inst Adv Struct Technol, Beijing 100081, Peoples R China.
Recommended Citation
GB/T 7714
Peng ZL,Wang C,Yang YZ,et al. Effect of relative humidity on the peeling behavior of a thin film on a rigid substrate[J]. PHYSICAL REVIEW E,2016,94(3):32801.
APA 彭志龙,王琮,Yang YZ,陈少华,&Chen, SH .(2016).Effect of relative humidity on the peeling behavior of a thin film on a rigid substrate.PHYSICAL REVIEW E,94(3),32801.
MLA 彭志龙,et al."Effect of relative humidity on the peeling behavior of a thin film on a rigid substrate".PHYSICAL REVIEW E 94.3(2016):32801.
Files in This Item: Download All
File Name/Size DocType Version Access License
PhysRevE.94.pdf(1113KB) 开放获取--View Download
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[彭志龙]'s Articles
[王琮]'s Articles
[Yang YZ]'s Articles
Baidu academic
Similar articles in Baidu academic
[彭志龙]'s Articles
[王琮]'s Articles
[Yang YZ]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[彭志龙]'s Articles
[王琮]'s Articles
[Yang YZ]'s Articles
Terms of Use
No data!
Social Bookmark/Share
File name: PhysRevE.94.pdf
Format: Adobe PDF
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.