IMECH-IR  > 非线性力学国家重点实验室
Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations
Yang XS; Wang YJ; Zhai HR; Wang GY; Su YJ; Dai LH(戴兰宏); Ogata S; Zhang TY; Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.; Zhang, TY (reprint author), Shanghai Univ, Shanghai Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
Source PublicationJOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
2016
Volume94Pages:191-206
ISSN0022-5096
AbstractIn the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 degrees C (RT), 40 degrees C, 50 degrees C, 60 degrees C, and 70 degrees C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinfling could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper. (C) 2016 Elsevier Ltd. All rights reserved.
KeywordCreep Nanotwin Activation Parameters Hrtem Atomistic Simulations
DOI10.1016/j.jmps.2016.04.021
URL查看原文
Indexed BySCI ; EI
Language英语
WOS IDWOS:000382342300012
WOS KeywordCreep ; Nanotwin ; Activation parameters ; HRTEM ; Atomistic simulations
WOS Research AreaMaterials Science ; Mechanics ; Physics
WOS SubjectMaterials Science, Multidisciplinary ; Mechanics ; Physics, Condensed Matter
Funding OrganizationThis work was supported by the General Research Fund (No. 622911) from the Hong Kong Research Grants Council and the National Basic Research Program of China (No. 2012CB937502). T.Y.Z. is grateful for the financial support by the Research Grant (No.14DZ2261200) from the Science and Technology Commission of Shanghai Municipality. Y.J.W and L.H.D acknowledge the financial supports from the NSFC (Nos. 11132011, 11402269, 11472287), the National Key Basic Research Program of China (No. 2012CB937500), and the CAS/SAFEA International Partnership Program for Creative Research Teams. G.Y. W thanks the National Natural Science Foundation (No. 51401083).
DepartmentLNM冲击动力学与新型材料力学性能
Classification一类
RankingTrue
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Cited Times:13[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/59744
Collection非线性力学国家重点实验室
Corresponding AuthorZhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.; Zhang, TY (reprint author), Shanghai Univ, Shanghai Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China.
Recommended Citation
GB/T 7714
Yang XS,Wang YJ,Zhai HR,et al. Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2016,94:191-206.
APA Yang XS.,Wang YJ.,Zhai HR.,Wang GY.,Su YJ.,...&Zhang, TY .(2016).Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,94,191-206.
MLA Yang XS,et al."Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 94(2016):191-206.
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