Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations | |
Yang XS; Wang YJ(王云江); Zhai HR; Wang GY; Su YJ; Dai LH(戴兰宏); Ogata S; Zhang TY; Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China. | |
发表期刊 | JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS |
2016 | |
卷号 | 94页码:191-206 |
ISSN | 0022-5096 |
摘要 | In the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 degrees C (RT), 40 degrees C, 50 degrees C, 60 degrees C, and 70 degrees C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinfling could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper. (C) 2016 Elsevier Ltd. All rights reserved. |
关键词 | Creep Nanotwin Activation Parameters Hrtem Atomistic Simulations |
DOI | 10.1016/j.jmps.2016.04.021 |
URL | 查看原文 |
收录类别 | SCI ; EI |
语种 | 英语 |
WOS记录号 | WOS:000382342300012 |
关键词[WOS] | Creep ; Nanotwin ; Activation parameters ; HRTEM ; Atomistic simulations |
WOS研究方向 | Materials Science ; Mechanics ; Physics |
WOS类目 | Materials Science, Multidisciplinary ; Mechanics ; Physics, Condensed Matter |
项目资助者 | This work was supported by the General Research Fund (No. 622911) from the Hong Kong Research Grants Council and the National Basic Research Program of China (No. 2012CB937502). T.Y.Z. is grateful for the financial support by the Research Grant (No.14DZ2261200) from the Science and Technology Commission of Shanghai Municipality. Y.J.W and L.H.D acknowledge the financial supports from the NSFC (Nos. 11132011, 11402269, 11472287), the National Key Basic Research Program of China (No. 2012CB937500), and the CAS/SAFEA International Partnership Program for Creative Research Teams. G.Y. W thanks the National Natural Science Foundation (No. 51401083). |
课题组名称 | LNM冲击动力学与新型材料力学性能 |
论文分区 | 一类 |
力学所作者排名 | 2 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://dspace.imech.ac.cn/handle/311007/59744 |
专题 | 非线性力学国家重点实验室 |
通讯作者 | Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China. |
推荐引用方式 GB/T 7714 | Yang XS,Wang YJ,Zhai HR,et al. Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2016,94:191-206. |
APA | Yang XS.,Wang YJ.,Zhai HR.,Wang GY.,Su YJ.,...&Zhang, TY .(2016).Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,94,191-206. |
MLA | Yang XS,et al."Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 94(2016):191-206. |
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