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In-Plane Deformation Mechanics for Highly Stretchable Electronics
Su YW(苏业旺); Ping XC; Yu KJ; Lee JW; Fan JA; Wang B; Li M; Li R; Harburg DV; Huang YA; Yu CJ; Mao SM; Shim J; Yang QL; Lee PY; Armonas A; Choi KJ; Yang YC; Paik U; Chang T; Dawidczyk TJ; Huang YG; Wang SD; Rogers JA; Wang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA.
Source PublicationADVANCED MATERIALS
2017-02
Volume29Issue:8Pages:UNSP 1604989
ISSN0935-9648
Abstract

Scissoring in thick bars suppresses buckling behavior in serpentine traces that have thicknesses greater than their widths, as detailed in a systematic set of analytical and experimental studies. Scissoring in thick copper traces enables elastic stretchability as large as approximate to 350%, corresponding to a sixfold improvement over previously reported values for thin geometries (approximate to 60%).

DOI10.1002/adma.201604989
URL查看原文
Indexed BySCI ; EI
Language英语
WOS IDWOS:000395187900019
WOS KeywordBuckling Mechanics ; Scissoring ; Non-buckling ; Stretchable Electronics
WOS Research AreaChemistry ; Science & Technology - Other Topics ; Materials Science ; Physics
WOS SubjectChemistry, Multidisciplinary ; Chemistry, Physical ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
Funding OrganizationY.S. acknowledges the support from Chinese Academy of Sciences via the
DepartmentLNM柔性结构与先进材料力学
Classification一类
Ranking1
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Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/60114
Collection非线性力学国家重点实验室
Corresponding AuthorWang, SD (reprint author), Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61820 USA.; Rogers, JA (reprint author), Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61820 USA.
Recommended Citation
GB/T 7714
Su YW,Ping XC,Yu KJ,et al. In-Plane Deformation Mechanics for Highly Stretchable Electronics[J]. ADVANCED MATERIALS,2017,29(8):UNSP 1604989.
APA Su YW.,Ping XC.,Yu KJ.,Lee JW.,Fan JA.,...&Rogers, JA .(2017).In-Plane Deformation Mechanics for Highly Stretchable Electronics.ADVANCED MATERIALS,29(8),UNSP 1604989.
MLA Su YW,et al."In-Plane Deformation Mechanics for Highly Stretchable Electronics".ADVANCED MATERIALS 29.8(2017):UNSP 1604989.
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