IMECH-IR  > 力学所知识产出(1956-2008)
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
Lee SWR; Dai LH(戴兰宏)
会议录名称American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
2001
会议名称2001 ASME International Mechanical Engineering Congress and Exposition
会议日期November 11, 2001 - November 16, 2001
会议地点New York, NY, United states
摘要The present study is aimed at the experimental characterization of strain-rate dependent behaviour of solder materials under impulsive shear loading. In order to achieve this objective, a unique testing technique, namely, split Hopkinson torsion bar (SHTB) is employed. The solder material under investigation is 63Sn-37Pb. The experimental results indicate that the shear behavior of the solder joint is very sensitive to the strain rate and the dynamic shear strength of the solder joint is much higher than the static one.
关键词Elastic Stress Shear Loading Temperature Cycling
ISBN号0-7918-3565-0
收录类别EI
语种英语
文献类型会议论文
条目标识符http://dspace.imech.ac.cn/handle/311007/60250
专题力学所知识产出(1956-2008)
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Lee SWR,Dai LH. Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)[C]American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP,2001.
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