IMECH-IR  > 力学所知识产出(1956-2008)
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy
Dai LH(戴兰宏); Lee SWR
Source PublicationAdvances in Electronic Packaging
Conference NamePacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Conference DateJuly 8, 2001 - July 13, 2001
Conference PlaceKauai, Hi, United states
AbstractA novel punch shear testing method is introduced in this study to investigate the strain rate-dependent shear behavior of solder materials. Both static and dynamic shear strengths of 63 Sn-37Pb solder were characterized. The experimental results indicate that the shear response of solder alloy is very sensitive to the strain rate and the dynamic shear strength is much higher than the static one. Besides, the localized crack band was found in the dynamic punch shear tests. This phenomenon reveals that the adiabatic shear localization should be a significant mechanism for controlling the mechanical behavior of 63Sn-37Pb solder alloy under dynamic shear loading.
KeywordAdiabatic Shear Localization (Asl)
Indexed ByEI
Document Type会议论文
Recommended Citation
GB/T 7714
Dai LH,Lee SWR. Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy[C]Advances in Electronic Packaging,2001.
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