Microstructure of Plastic Bonded Explosives and Its Evolution after Thermal and Mechanical Aggressions

IMECH-IR > 力学所知识产出(1956-2008)

	Microstructure of Plastic Bonded Explosives and Its Evolution after Thermal and Mechanical Aggressions
	Chen PW; Huang FL; Ding YS(丁雁生)
会议录名称	Proceedings of the 2003 International Autumn Seminar on Propellants, Explosives and Pyrotechnics (2003 IASPEP) - Theory and Practice of Energetic Materials
	2003
会议名称	Proceedings of the 2003 International Autumn Seminar on Propellants, Explosives and Pyrotechnics (2003 IASPEP) - Theory and Practice of Energetic Materials
会议日期	October 15, 2003 - October 18, 2003
会议地点	Guilin, China
摘要	Because sensitivity of an explosive is highly controlled by its microstructure, it is very important to examine and characterize it. Both scanning electronic microscopy and polarized light microscopy were chosen to .examine the microstructure of selected plastic bonded explosives. The initial microstructure of hot pressed plastic bonded explosives and its evolution under thermal and mechanical aggressions were studied. To better reveal the microstructure, polishing and etching techniques were developed to prepare the samples of microscopic examination. The thermal aggressions included low temperature freezing and frozen combustion. Mechanical aggressions included quasi-static Brazilian test, uniaxial compression, ultrasonic wave insult and long-pulse low-velocity impact. The characteristic damage modes under different solicitations were analyzed.
关键词	Damage Mechanical Aggression Polymer Bonded Explosives Thermal Aggression
WOS记录号	WOS:000188997600072
收录类别	CPCI-S ; EI
语种	英语
引用统计
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/60267
专题	力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Chen PW,Huang FL,Ding YS. Microstructure of Plastic Bonded Explosives and Its Evolution after Thermal and Mechanical Aggressions[C]Proceedings of the 2003 International Autumn Seminar on Propellants, Explosives and Pyrotechnics (2003 IASPEP) - Theory and Practice of Energetic Materials,2003.

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