IMECH-IR  > 力学所知识产出(1956-2008)
Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems
Wei YG(魏悦广); Zhao HF; Shu SQ
Source Publication11th International Conference on Fracture 2005, ICF11
2005
Conference Name11th International Conference on Fracture 2005, ICF11
Conference DateMarch 20, 2005 - March 25, 2005
Conference PlaceTurin, Italy
AbstractIn this paper, both the cohesive zone/nonlinear bending model and the cohesive zone/plane strain elastic-plastic FE analysis model are adopted for analyzing the thin film nonlinear peeling process. Characteristics of the energy release rate are analyzed and presented. The analysis results based on both models are used to predict peeling experiment of copper thin film on the ceramic interface. Through prediction and analyses, one found that for the same experimental result, the effective simulations can be obtained based on both models, however, different material parameters are corresponded. It implies that two models are suitable for different scales. Combining the results based on both models, size effects of thin film delamination are characterized.
KeywordCohesive Zones Copper Thin Film Different Scale Elastic-plastic Fe Analysis Interfacial Fracture Material Parameter Multi Scale Analysis Prediction And Analysis Size Effects Substrate System Thin Film Delamination
Indexed ByEI
Language英语
Document Type会议论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/60282
Collection力学所知识产出(1956-2008)
Recommended Citation
GB/T 7714
Wei YG,Zhao HF,Shu SQ. Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems[C],2005.
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