Extracting nanowire mechanical properties from three-point bendig test

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	Extracting nanowire mechanical properties from three-point bendig test
	Liu Y; Zhang Y(张吟); Liu, Y.
会议录名称	2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
	2010
会议名称	2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010
会议日期	June 2, 2010 - June 5, 2010
会议地点	Las Vegas, NV, United states
摘要	A new adhesive receding contact model is presented in this paper for the nanowire in three-point bending test. Because of its flexurality, the nanowire in test may lift-off/separate from its supporting elastic medium, which can dramatically change the nanowire boundary conditions and deformations. The changes of the nanowire boundary conditions and deformations have the significant impact on the interpretation of the experimental data on the nanowire material properties. Through the model developed here, some explanations are offered to the different even contradicting observations on the nanowire material properties and the nanowire boundary conditions changing trends found in recent experiments. ©2010 IEEE.
关键词	Changing Trends Elastic Medium Experimental Data Nanowire Materials Receding Contact Significant Impacts Three-point Bending Test Young's Modulus
WOS记录号	WOS:000287517900143
课题组名称	LNM纳/微系统力学与物理力学
ISBN号	9781424453429
URL	查看原文
收录类别	CPCI-S ; EI
语种	英语
引用统计	被引频次：1[WOS] [WOS记录] [WOS相关记录]
文献类型	会议论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/60347
专题	非线性力学国家重点实验室
通讯作者	Liu, Y.
推荐引用方式 GB/T 7714	Liu Y,Zhang Y,Liu, Y.. Extracting nanowire mechanical properties from three-point bendig test[C]2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010,2010.