Extracting nanowire mechanical properties from three-point bendig test | |
Liu Y; Zhang Y(张吟); Liu, Y. | |
Source Publication | 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 |
2010 | |
Conference Name | 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010 |
Conference Date | June 2, 2010 - June 5, 2010 |
Conference Place | Las Vegas, NV, United states |
Abstract | A new adhesive receding contact model is presented in this paper for the nanowire in three-point bending test. Because of its flexurality, the nanowire in test may lift-off/separate from its supporting elastic medium, which can dramatically change the nanowire boundary conditions and deformations. The changes of the nanowire boundary conditions and deformations have the significant impact on the interpretation of the experimental data on the nanowire material properties. Through the model developed here, some explanations are offered to the different even contradicting observations on the nanowire material properties and the nanowire boundary conditions changing trends found in recent experiments. ©2010 IEEE. |
Keyword | Changing Trends Elastic Medium Experimental Data Nanowire Materials Receding Contact Significant Impacts Three-point Bending Test Young's Modulus |
WOS ID | WOS:000287517900143 |
Department | LNM纳/微系统力学与物理力学 |
ISBN | 9781424453429 |
URL | 查看原文 |
Indexed By | CPCI-S ; EI |
Language | 英语 |
Citation statistics | |
Document Type | 会议论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/60347 |
Collection | 非线性力学国家重点实验室 |
Corresponding Author | Liu, Y. |
Recommended Citation GB/T 7714 | Liu Y,Zhang Y,Liu, Y.. Extracting nanowire mechanical properties from three-point bendig test[C]2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010,2010. |
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