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Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics
Li S; Liu XL; Li R; Su YW(苏业旺); Su, YW (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.; Li, R; Su, YW (reprint author), Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China.; Su, YW (reprint author), Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China.
Source PublicationINTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
2017-04-01
Volume110Pages:305-314
ISSN0020-7683
Abstract

Flexible electronics has attracted much attention in recent years due to the favorable applications to many emerging devices. A novel laminated structure for a new-generation of flexible electronics is composed of several thin layers where the hard functional components are built glued by soft adhesives. To prevent the premature mechanical failure and to achieve the best performance of the electronics the structural design of such a laminate is of crucial importance. Accordingly it is necessary to establish an analytic model to accurately describe the mechanical behavior of the laminated structure. The available models fall into two categories: those only taking into account the normal strain-induced deformation of the soft adhesive layers and those only incorporating the shear deformation of the same layers. This paper aims to quantitatively figure out which deformation dominates. By establishing an accurate enough analytic model a significant finding is revealed that shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics while the normal strain-induced deformation is negligible. The model is Well validated by the finite element method (FEM). The effects of the membrane energy and bending energy of the soft layer are also investigated by incorporating or neglecting the shear energy. The model accurately captures the key quantities such as the strain distribution in each layer and the locations of the neutral mechanical planes of the top and bottom layers. This work is expected to provide the design guidelines for the laminated structure-based flexible electronics. (C) 2016 Elsevier Ltd. All rights reserved.

KeywordShear Deformation Adhesive Layer Laminated Structure Flexible Electronics
DOI10.1016/j.ijsolstr.2016.12.006
Indexed BySCI ; EI
Language英语
WOS IDWOS:000397548800027
WOS KeywordSTRETCHABLE ELECTRONICS ; SANDWICH PANELS ; INTERCONNECTS ; MECHANICS ; DEVICES ; CORE ; EYE
WOS Research AreaMechanics
WOS SubjectMechanics
Funding OrganizationNational Natural Science Foundation of China(11572323 ; Chinese Academy of Sciences via the "Hundred Talent program" ; State Key Laboratory of Structural Analysis for Industrial Equipment Dalian University of Technology(GZ1603) ; 11302038)
DepartmentLNM柔性结构与先进材料力学
Classification一类/力学重要期刊
Ranking1
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/60564
Collection非线性力学国家重点实验室
Corresponding AuthorSu, YW (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China.; Li, R; Su, YW (reprint author), Dalian Univ Technol, Dept Engn Mech, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China.; Su, YW (reprint author), Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China.
Recommended Citation
GB/T 7714
Li S,Liu XL,Li R,et al. Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics[J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES,2017,110:305-314.
APA Li S.,Liu XL.,Li R.,苏业旺.,Su, YW .,...&Su, YW .(2017).Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics.INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES,110,305-314.
MLA Li S,et al."Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics".INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES 110(2017):305-314.
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