Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments | |
Long X; Wang SB; Feng YH(冯义辉); Yao Y; Keer LM; Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China. | |
发表期刊 | MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING |
2017-06-01 | |
卷号 | 696页码:90-95 |
ISSN | 0921-5093 |
摘要 | In this study, residual stress in Sn-3.0Ag-0.5Cu lead-free solder after annealing at varying temperature and duration was investigated by nanoindentation and uniaxial tensile experiments. Based on the unloading response of load-penetration depth, the contact stiffness was theoretically calculated and found to be decreased with increasing annealing duration especially at the annealing temperature of 210 degrees C. Additionally, the effect of residual stress on constitutive behaviour at strain rates of 1 x 10(-3) s(-1), 5 x 10(-4)s(-1) and 1 x 10(-4) s(-1) was consistently observed. By correlating residual stress and elastic indentation recovery, it was confirmed that greater contact stiffness is induced by greater compressive residual stress. Therefore, the optimal annealing condition of SAC305 solder is 210 degrees C for 12 h, which is believed to minimize the residual stress and stabilize the mechanical property of annealed solder. |
关键词 | Lead-free Solder Annealing Residual Stress Nanoindentation Constitutive Behaviour |
DOI | 10.1016/j.msea.2017.04.066 |
收录类别 | SCI ; EI |
语种 | 英语 |
WOS记录号 | WOS:000405881700010 |
关键词[WOS] | STRAIN-RATE SENSITIVITY ; LEAD-FREE SOLDERS ; INDENTATION EXPERIMENTS ; TENSILE PROPERTIES ; YOUNGS MODULUS ; BEHAVIOR ; ALLOYS ; STEEL |
WOS研究方向 | Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering |
WOS类目 | Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
项目资助者 | National Natural Science Foundation of China(51508464 ; Fundamental Research Funds for the Central Universities(3102016ZY017) ; 11572249) |
课题组名称 | LNM实验平台 |
论文分区 | 一类 |
力学所作者排名 | 3 |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://dspace.imech.ac.cn/handle/311007/60909 |
专题 | 非线性力学国家重点实验室 |
通讯作者 | Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China. |
推荐引用方式 GB/T 7714 | Long X,Wang SB,Feng YH,et al. Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2017,696:90-95. |
APA | Long X,Wang SB,Feng YH,Yao Y,Keer LM,&Long, X .(2017).Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,696,90-95. |
MLA | Long X,et al."Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 696(2017):90-95. |
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