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Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments
Long X; Wang SB; Feng YH(冯义辉); Yao Y; Keer LM; Long, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
2017-06-01
Volume696Pages:90-95
ISSN0921-5093
Abstract

In this study, residual stress in Sn-3.0Ag-0.5Cu lead-free solder after annealing at varying temperature and duration was investigated by nanoindentation and uniaxial tensile experiments. Based on the unloading response of load-penetration depth, the contact stiffness was theoretically calculated and found to be decreased with increasing annealing duration especially at the annealing temperature of 210 degrees C. Additionally, the effect of residual stress on constitutive behaviour at strain rates of 1 x 10(-3) s(-1), 5 x 10(-4)s(-1) and 1 x 10(-4) s(-1) was consistently observed. By correlating residual stress and elastic indentation recovery, it was confirmed that greater contact stiffness is induced by greater compressive residual stress. Therefore, the optimal annealing condition of SAC305 solder is 210 degrees C for 12 h, which is believed to minimize the residual stress and stabilize the mechanical property of annealed solder.

KeywordLead-free Solder Annealing Residual Stress Nanoindentation Constitutive Behaviour
DOI10.1016/j.msea.2017.04.066
Indexed BySCI ; EI
Language英语
WOS IDWOS:000405881700010
WOS KeywordSTRAIN-RATE SENSITIVITY ; LEAD-FREE SOLDERS ; INDENTATION EXPERIMENTS ; TENSILE PROPERTIES ; YOUNGS MODULUS ; BEHAVIOR ; ALLOYS ; STEEL
WOS Research AreaScience & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectNanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
Funding OrganizationNational Natural Science Foundation of China(51508464 ; Fundamental Research Funds for the Central Universities(3102016ZY017) ; 11572249)
DepartmentLNM实验平台
Classification一类
Ranking3
Citation statistics
Cited Times:12[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/60909
Collection非线性力学国家重点实验室
Corresponding AuthorLong, X (reprint author), Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China.
Recommended Citation
GB/T 7714
Long X,Wang SB,Feng YH,et al. Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2017,696:90-95.
APA Long X,Wang SB,Feng YH,Yao Y,Keer LM,&Long, X .(2017).Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,696,90-95.
MLA Long X,et al."Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 696(2017):90-95.
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