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Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect
Xu W(徐渭); Yu HC; Tao CH; Xu, W
Source PublicationINTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
2015
Volume59Pages:86-97
ISSN0143-7496
DOI10.1016/j.ijadhadh.2015.02.007
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Indexed BySCI ; EI
Language英语
WOS IDWOS:000353006100011
WOS Research AreaEngineering ; Materials Science
Classification二类
Ranking1
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Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/77413
Collection非线性力学国家重点实验室
Corresponding AuthorXu, W
Recommended Citation
GB/T 7714
Xu W,Yu HC,Tao CH,et al. Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect[J]. INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES,2015,59:86-97.
APA 徐渭,Yu HC,Tao CH,&Xu, W.(2015).Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect.INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES,59,86-97.
MLA 徐渭,et al."Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect".INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES 59(2015):86-97.
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