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A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack
Yi DK(易大可); Wang TC(王自强)
发表期刊SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY
2018-06-01
卷号61期号:6页码:64611
ISSN1674-7348
摘要

In the paper, a new procedure is proposed to investigate three-dimensional fracture problems of a thin elastic plate with a long through-the-thickness crack under remote uniform tensile loading. The new procedure includes a new analytical method and high accurate finite element simulations. In the part of theoretical analysis, three-dimensional Maxwell stress functions are employed in order to derive three-dimensional crack tip fields. Based on the theoretical analysis, an equation which can describe the relationship among the three-dimensional J-integral J(z), the stress intensity factor K(z) and the tri-axial stress constraint level T-z (z) is derived first. In the part of finite element simulations, a fine mesh including 153360 elements is constructed to compute the stress field near the crack front, J(z) and T-z(z). Numerical results show that in the plane very close to the free surface, the K field solution is still valid for in-plane stresses. Comparison with the numerical results shows that the analytical results are valid.

关键词three-dimensional fracture analysis out-of-plane constraint three-dimensional J-integral
DOI10.1007/s11433-017-9138-x
URL查看原文
收录类别SCI ; EI ; CSCD
语种英语
WOS记录号WOS:000428505200001
关键词[WOS]SINGULAR STRESS ; ELASTIC PLATE ; FRONT ; TIP ; FRACTURE ; SHEAR
WOS研究方向Physics, Multidisciplinary
WOS类目Physics
项目资助者Fundamental Research Funds for the Central Universities [2014B1801]
CSCD记录号CSCD:6273105
论文分区二类/Q1
力学所作者排名1
引用统计
被引频次:3[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://dspace.imech.ac.cn/handle/311007/77905
专题非线性力学国家重点实验室
作者单位1.Hohai Univ, Coll Mech & Mat, Nanjing 211100, Jiangsu, Peoples R China
2.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
推荐引用方式
GB/T 7714
Yi DK,Wang TC. A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack[J]. SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY,2018,61,6,:64611.
APA Yi DK,&Wang TC.(2018).A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack.SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY,61(6),64611.
MLA Yi DK,et al."A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack".SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY 61.6(2018):64611.
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