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Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate
Yin HB; Chen SH; Liang LH(梁立红); Peng ZL(彭志龙); Wei YG(魏悦广)
发表期刊JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
2018-09-01
卷号85期号:9页码:Ar-91004
ISSN0021-8936
摘要The whole peeling behavior of thin films on substrates attract lots of research interests due to the wide application of film-substrate systems, which was well modeled theoretically by introducing Lennard-Jones (L-J) potential to describe the interface in Peng and Chen (2015, Effect of Bending Stiffness on the Peeling Behavior of an Elastic Thin Film on a Rigid Substrate," Phys. Rev. E, 91(4), p. 042401). However, it is difficult for real applications because the parameters in the L-J potential are difficult to determine experimentally. In this paper, with the help of the peeling test and combining the constitutive relation of a cohesive zone model (CZM) with the L-J potential, we establish a new method to find the parameters in the L-J potential. The whole peeling process can then be analyzed quantitatively. Both the theoretical prediction and the experimental result agree well with each other. Finite element simulations of the whole peeling process are carried out subsequently. Quantitative agreements among the theoretical prediction, numerical calculation, and the experiment measurement further demonstrate the feasibility of the method. Effects of not only the interface strength but also the interface toughness on the whole peeling behavior are analyzed. It is found that the peeling force at a peeling angle of 90 deg during the steady-state stage is affected only by the interface toughness, while the peeling force before the steady-state stage would be influenced significantly by the interface toughness, interface strength, and bending stiffness of the film. All the present results should be helpful for deep understanding and theoretical prediction of the interface behavior of film-substrate systems in real applications.
关键词film-substrate system interface behavior peeling force cohesive zone model L-J potential
DOI10.1115/1.4040336
URL查看原文
收录类别SCI ; EI
语种英语
WOS记录号WOS:000447286400004
关键词[WOS]DUCTILE THIN-FILMS ; INTERFACE STRENGTH ; ADHESION ; MODELS ; SIMULATIONS ; PLASTICITY ; COATINGS ; BEHAVIOR ; SYSTEMS ; WORK
WOS研究方向Mechanics
WOS类目Mechanics
项目资助者BIT Creative Research Plan ; National Natural Science Foundation of China [11672296, 11372318, 11532013]
论文分区一类/力学重要期刊
力学所作者排名1
引用统计
文献类型期刊论文
条目标识符http://dspace.imech.ac.cn/handle/311007/78131
专题非线性力学国家重点实验室
作者单位1.[Yin, H. B.
2.Liang, L. H.] Chinese Acad Sci, Inst Mech, LNM, Beijing 100190, Peoples R China
3.Liang, L. H.] Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China
4.[Chen, S. H.
5.Peng, Z. L.] Beijing Inst Technol, Inst Adv Struct Technol, Beijing 100081, Peoples R China
6.Peng, Z. L.] Beijing Inst Technol, Beijing Key Lab Lightweight Multifunct Composite, Beijing 100081, Peoples R China
7.[Wei, Y. G.] Peking Univ, Coll Engn, Beijing 100871, Peoples R China
推荐引用方式
GB/T 7714
Yin HB,Chen SH,Liang LH,et al. Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate[J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,2018,85(9):Ar-91004.
APA Yin HB,Chen SH,梁立红,彭志龙,&魏悦广.(2018).Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate.JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,85(9),Ar-91004.
MLA Yin HB,et al."Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate".JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME 85.9(2018):Ar-91004.
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