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Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder
Long X; Zhang XD; Tang WB; Wang SB; Feng YH(冯义辉); Chang C
Source PublicationMICROMACHINES
2018-11-01
Volume9Issue:11Pages:Ar-608
ISSN2072-666X
AbstractIt is challenging to evaluate constitutive behaviour by using conventional uniaxial tests for materials with limited sizes, considering the miniaturization trend of integrated circuits in electronic devices. An instrumented nanoindentation approach is appealing to obtain local properties as the function of penetration depth. In this paper, both conventional tensile and nanoindentation experiments are performed on samples of a lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy. In order to align the material behaviour, thermal treatments were performed at different temperatures and durations for all specimens, for both tensile experiments and nanoindentation experiments. Based on the self-similarity of the used Berkovich indenter, a power-law model is adopted to describe the stress-strain relationship by means of analytical dimensionless analysis on the applied load-penetration depth responses from nanoindentation experiments. In light of the significant difference of applied strain rates in the tensile and nanoindentation experiments, two rate factors are proposed by multiplying the representative stress and stress exponent in the adopted analytical model, and the corresponding values are determined for the best predictions of nanoindentation responses in the form of an applied load-indentation depth relationship. Eventually, good agreement is achieved when comparing the stress-strain responses measured from tensile experiments and estimated from the applied load-indentation depth responses of nanoindentation experiments. The rate factors
Keywordnanoindentation constitutive model rate factor dimensionless analysis solder
DOI10.3390/mi9110608
URL查看原文
Indexed BySCI ; EI
Language英语
WOS IDWOS:000451314900071
WOS KeywordSTRAIN-RATE SENSITIVITY ; INSTRUMENTED INDENTATION ; MICROSTRUCTURE ; BEHAVIOR ; STRESS ; CREEP
WOS Research AreaNanoscience & Nanotechnology ; Instruments & Instrumentation
WOS SubjectScience & Technology - Other Topics ; Instruments & Instrumentation
Funding OrganizationNational Natural Science Foundation of China [51508464] ; Natural Science Foundation of Shaanxi Province [2017JM1013] ; Astronautics Supporting Technology Foundation of China [2018-HT-XG] ; Fundamental Research Funds for the Central Universities [3102018ZY015]
Classification二类
Ranking5
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Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/78164
Collection非线性力学国家重点实验室
Affiliation1.Northwestern Polytech Univ, Sch Mech & Civil & Architecture, Xian 710072, Shaanxi, Peoples R China
2.Liaoning Shihua Univ, Coll Min Engn, Fushun 113001, Peoples R China
3.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
4.Taiyuan Univ Sci & Technol, Sch Appl Sci, Taiyuan 030024, Shanxi, Peoples R China
Recommended Citation
GB/T 7714
Long X,Zhang XD,Tang WB,et al. Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder[J]. MICROMACHINES,2018,9(11):Ar-608.
APA Long X,Zhang XD,Tang WB,Wang SB,冯义辉,&Chang C.(2018).Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder.MICROMACHINES,9(11),Ar-608.
MLA Long X,et al."Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder".MICROMACHINES 9.11(2018):Ar-608.
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