IMECH-IR  > 非线性力学国家重点实验室
Adhesion-Free Thin-Film-Like Curvature Sensors Integrated on Flexible and Wearable Electronics for Monitoring Bending of Joints and Various Body Gestures
Liu H; Zhao HY; Li S(李爽); Hu JQ(胡剑桥); Zheng XR; Li R; Chen YL; Su Yewang
Source PublicationADVANCED MATERIALS TECHNOLOGIES
2019-02-01
Volume4Issue:2Pages:AR1800327
ISSN2365-709X
AbstractFlexible and wearable electronics integrated with various sensors have great potential for applications in monitoring human activities and personal health. Bending and tension/compression dominate the deformation modes yielded by flexure of joints and diverse body gestures. A key challenge now is to sense the curvature/bending angle, while much research has been focused on the strain sensors for tension/compression. Alternative approaches by strain sensors or noncontact optical methods for curvature sensing are not practical for wearable electronics. A novel adhesion-free thin-film-like curvature sensor that can monitor bending activities is introduced for flexible and wearable electronics. This study presents comprehensive design, fabrication, mechanism, structural analysis, performance characterization, and device-level demonstrations for bending of joints, gesture recognition, and real-time sitting posture correction. The most prominent advantage of the present sensor is that the measurement is independent of the strain of the target surface and the interfacial slippage, thus the perfect adhesion between the sensor and the surface is unnecessary. The features of adhesion-free, simple mechanical principle, low cost, and satisfactory monitoring results highlight the superiority of the present curvature sensors for practical applications to flexible and wearable electronics.
Keywordadhesion-free curvature sensor flexible electronics stretchable electronics
DOI10.1002/admt.201800327
Indexed BySCI ; EI
Language英语
WOS IDWOS:000459632800011
WOS KeywordSTRAIN SENSOR ; PRESSURE SENSOR ; LARGE-AREA ; SKIN ; TRANSPARENT ; FIBER ; RECOGNITION ; FABRICATION ; COMPOSITES ; RANGE
WOS Research AreaMaterials Science, Multidisciplinary
WOS SubjectMaterials Science
Funding OrganizationNational Natural Science Foundation of China [11772331, 11572323, 11302038, 11622214, 11472027] ; Chinese Academy of Sciences via the "Hundred Talent Program," Strategic Priority Research Program of the Chinese Academy of Sciences [XDB22040501] ; Program for New Century Excellent Talents in University [NCET-13-0021] ; Young Elite Scientists Sponsorship Program by CAST [2015QNRC001] ; Opening Fund of State Key Laboratory of Nonlinear Mechanics, Chinese Academy of Sciences ; Fundamental Research Funds for the Central Universities of China [DUT18GF101]
Classification二类/Q1
Ranking1
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/78262
Collection非线性力学国家重点实验室
Affiliation1.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
2.Beihang Univ BUAA, Inst Solid Mech, Beijing 100191, Peoples R China
3.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 100049, Peoples R China
4.Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dept Engn Mech, Dalian 116024, Peoples R China
5.Dalian Univ Technol, Int Res Ctr Computat Mech, Dalian 116024, Peoples R China
6.Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
Recommended Citation
GB/T 7714
Liu H,Zhao HY,Li S,et al. Adhesion-Free Thin-Film-Like Curvature Sensors Integrated on Flexible and Wearable Electronics for Monitoring Bending of Joints and Various Body Gestures[J]. ADVANCED MATERIALS TECHNOLOGIES,2019,4(2):AR1800327.
APA Liu H.,Zhao HY.,李爽.,胡剑桥.,Zheng XR.,...&Su Yewang.(2019).Adhesion-Free Thin-Film-Like Curvature Sensors Integrated on Flexible and Wearable Electronics for Monitoring Bending of Joints and Various Body Gestures.ADVANCED MATERIALS TECHNOLOGIES,4(2),AR1800327.
MLA Liu H,et al."Adhesion-Free Thin-Film-Like Curvature Sensors Integrated on Flexible and Wearable Electronics for Monitoring Bending of Joints and Various Body Gestures".ADVANCED MATERIALS TECHNOLOGIES 4.2(2019):AR1800327.
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