CHT/CFD Analysis of Thermal Sensitivity of a Transonic Film-Cooled Guide Vane

doi:10.32604/cmes.2019.05579

IMECH-IR > 流固耦合系统力学重点实验室

	CHT/CFD Analysis of Thermal Sensitivity of a Transonic Film-Cooled Guide Vane
	Prapamonthon P; Yooyen S; Sleesongsom S
通讯作者	Prapamonthon, Prasert(prasert.pr@kmitl.ac.th)
发表期刊	CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES
	2019
卷号	119 期号:3 页码:593-615
ISSN	1526-1492
摘要	Thermal parameters are important variables that have great influence on life time of turbine vanes. Therefore, accurate prediction of the thermal parameters is essential. In this study, a numerical approach for conjugate heat transfer (CHT) and computational fluid dynamics (CFD) is used to investigate thermal sensitivity of a transonic guide vane which is fully film-cooled by 199 film holes. Thermal barrier coating (TBC), i.e., the typical TBC and a new one as the candidate TBC, and turbulence intensity (Tu), i.e., Tu=3.3%, 10% and 20%, are two variables used for the present study. At first the external surface temperatures of the vane material are compared. Next, the TBC surface temperatures are considered. Results show the major role of the lower thermal conductivity of TBC which results in the lower and more uniform temperature on the external surface of the vane substrate. Finally, the thermal sensitivity is presented in terms of the percentage reduction of the external surface temperatures of the vane material and the structural temperatures of the vane material at midspan, including the variations of average and maximum vane temperatures. Results show that TBC and Tu have significant effects on the external surface and structural temperatures of the vane substrate. The lower thermal conductivity of TBC leads to the higher difference between the thermal conductivity of the vane substrate and TBC, the reduction of heat transfer and the more uniform temperature within the vane structure. The results also show more effective protection for the average vane temperature from the two TBCs at higher Tus. However, Tu does not significantly affect the reduction of the maximum vane temperature even though the new TBC, which has the very low thermal conductivity, is used.
关键词	Conjugate heat transfer film cooling thermal sensitivity
DOI	10.32604/cmes.2019.05579
收录类别	SCI ; EI
语种	英语
WOS记录号	WOS:000469352200009
关键词[WOS]	CONJUGATE HEAT-TRANSFER ; FREESTREAM TURBULENCE ; BARRIER
WOS研究方向	Engineering ; Mathematics
WOS类目	Engineering, Multidisciplinary ; Mathematics, Interdisciplinary Applications
资助项目	KMITL Research Fund of King Mongkut's Institute of Technology Ladkrabang[KREF186015]
项目资助者	KMITL Research Fund of King Mongkut's Institute of Technology Ladkrabang
论文分区	Q4
力学所作者排名	1
RpAuthor	Prapamonthon, Prasert
引用统计	被引频次：4[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://dspace.imech.ac.cn/handle/311007/79340
专题	流固耦合系统力学重点实验室
推荐引用方式 GB/T 7714	Prapamonthon P,Yooyen S,Sleesongsom S. CHT/CFD Analysis of Thermal Sensitivity of a Transonic Film-Cooled Guide Vane[J]. CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES,2019,119,3,:593-615.
APA	Prapamonthon P,Yooyen S,&Sleesongsom S.(2019).CHT/CFD Analysis of Thermal Sensitivity of a Transonic Film-Cooled Guide Vane.CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES,119(3),593-615.
MLA	Prapamonthon P,et al."CHT/CFD Analysis of Thermal Sensitivity of a Transonic Film-Cooled Guide Vane".CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES 119.3(2019):593-615.

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