IMECH-IR  > 非线性力学国家重点实验室
Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper
Liu Y(刘瑶); Cai SL(蔡松林); Su MY(苏明耀); Wang YJ(王云江); Dai LH(戴兰宏)
Source PublicationMECHANICS OF MATERIALS
2019-12-01
Volume139Pages:UNSP 103207
ISSN0167-6636
AbstractHierarchical microstructure in partial recrystallized materials can simultaneously improve the strength and ductility of metallic materials. Modeling the mechanical behavior of partial recrystallized materials helps to process materials with superior combination of ductility and strength. Here, using experimental characterization, cellular automation (CA) and finite element method, hierarchical-microstructure based modeling was proposed to simulate the tensile deformation of partial recrystallized copper. Firstly, partial recrystallized coppers with different volume fractions of recrystallization were produced by means of extrusion machining and subsequent heat treatment (HT). Uniaxial tensile tests and microstructural observations show that the hierarchical-microstructure of recrystallized grains (RGs) surrounded by elongated subgrains has a significant effect on the mechanical properties. Then, based on the experimental results, a hierarchical-microstructure based plasticity model was developed to describe the yield surface of partial recrystallized materials. CA was further employed to simulate the hierarchical microstructure. By embedding the plasticity model and simulated hierarchical-microstructure in finite element method, a finite element model (FEM) for mechanical behavior of partial recrystallized copper was proposed, where the elongated subgrain with forest dislocation and low angle grain boundary, the RG with few dislocations and twin boundary, and volume fraction of recrystallization were taken into consideration. Finally, the experimental data and the comparison with the conventional plasticity model validate the rationality of the proposed model.
KeywordHierarchical microstructure Yield function Partial recrystallization Metallic material Mechanical property
DOI10.1016/j.mechmat.2019.103207
Indexed BySCI ; EI
Language英语
WOS IDWOS:000498756500015
WOS KeywordCELLULAR-AUTOMATON SIMULATION ; DYNAMIC RECRYSTALLIZATION ; MECHANICAL-PROPERTIES ; DISLOCATION DENSITY ; CONSTITUTIVE MODEL ; DUCTILITY ; STRENGTH ; STRAIN ; GROWTH ; FLOW
WOS Research AreaMaterials Science, Multidisciplinary ; Mechanics
WOS SubjectMaterials Science ; Mechanics
Classification二类/Q1
Ranking1
ContributorCai, SL (reprint author), ; Dai, LH (reprint author)
Citation statistics
Document Type期刊论文
Identifierhttp://dspace.imech.ac.cn/handle/311007/80787
Collection非线性力学国家重点实验室
Affiliation1.Univ Sci & Technol Beijing, Sch Math & Phys, Beijing 100083, Peoples R China
2.China Elect Power Res Inst, Beijing 100192, Peoples R China
3.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China
4.Univ Chinese Acad Sci, Sch Engn Sci, Beijing 101408, Peoples R China
Recommended Citation
GB/T 7714
Liu Y,Cai SL,Su MY,et al. Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper[J]. MECHANICS OF MATERIALS,2019,139:UNSP 103207.
APA 刘瑶,蔡松林,苏明耀,王云江,&戴兰宏.(2019).Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper.MECHANICS OF MATERIALS,139,UNSP 103207.
MLA 刘瑶,et al."Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper".MECHANICS OF MATERIALS 139(2019):UNSP 103207.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[刘瑶]'s Articles
[蔡松林]'s Articles
[苏明耀]'s Articles
Baidu academic
Similar articles in Baidu academic
[刘瑶]'s Articles
[蔡松林]'s Articles
[苏明耀]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[刘瑶]'s Articles
[蔡松林]'s Articles
[苏明耀]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.